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MSP430F6735AIPN

Texas Instruments

MSP430F6735AIPN by Texas Instruments

MSP430F6735AIPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 4096 RAM bytes, and 3 ADC channels. It operates at a max clock frequency of 25 MHz and features low power mode for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$6.598

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,201 parts In-Stock

1+ parts

$6.598

100+ parts

$5.379

1k+ parts

$3.586

10k+ parts

-

3,201

$6.598

$5.379

$3.586

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,641 parts In-Stock

1+ parts

$6.268

100+ parts

-

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-

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1,641

$6.268

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Vyrian

USA . 7,938 parts In-Stock

1+ parts

-

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7,938

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,675 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

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1,675

$5.938

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Microchip USA

USA . 1,671 parts In-Stock

1+ parts

$18.050

100+ parts

$17.790

1k+ parts

$17.660

10k+ parts

$17.540

1,671

$18.050

$17.790

$17.660

$17.540

AZTECH Wire

Italy . 277 parts In-Stock

1+ parts

$20.650

100+ parts

-

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277

$20.650

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Parana Technologies

USA . 867 parts In-Stock

1+ parts

$52.587

100+ parts

-

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867

$52.587

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DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$57.905

100+ parts

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2,312

$57.905

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ChromeModa Solutions

Germany . 2,612 parts In-Stock

1+ parts

$59.087

100+ parts

$48.451

1k+ parts

-

10k+ parts

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2,612

$59.087

$48.451

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IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$59.087

100+ parts

$56.133

1k+ parts

$53.178

10k+ parts

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552

$59.087

$56.133

$53.178

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Overview

Unlock the power of innovation with the MSP430F6735AIPN microcontroller by Texas Instruments. Designed for high-performance applications, this versatile device offers unparalleled quality and reliability. With a wide range of peripherals including LCD, RTC, and DMA, this microcontroller is perfect for industrial-grade projects. Experience the benefits of low power consumption, fast processing speeds, and seamless connectivity with I2C, SPI, and UART interfaces. Trust in Texas Instruments to deliver cutting-edge technology that meets your unique requirements and propels your projects to new heights. Elevate your designs with the MSP430F6735AIPN microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable design, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply requirements, making it versatile for different power sources.

Bit Size: 16

The 16-bit architecture provides improved processing capabilities compared to lower bit sizes, enabling more complex applications to be executed efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient processing, enhancing overall performance and speed of operations.

Technical Specifications

Microcontrollers MSP430F6735AIPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6735AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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