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MSP430F6734IPZ

Texas Instruments

MSP430F6734IPZ by Texas Instruments

MSP430F6734IPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 5-Ch 10-Bit ADC, and 4 PWM channels. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85 °C, and connectivity options like I2C and SPI.

Median Price

$5.634

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,452 parts In-Stock

1+ parts

$6.707

100+ parts

$5.468

1k+ parts

$3.645

10k+ parts

-

1,452

$6.707

$5.468

$3.645

-

Rochester

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$4.560

1k+ parts

$4.080

10k+ parts

$3.840

29

-

$4.560

$4.080

$3.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 806 parts In-Stock

1+ parts

$4.807

100+ parts

-

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-

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806

$4.807

-

-

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Vyrian

USA . 3,752 parts In-Stock

1+ parts

-

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-

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-

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3,752

-

-

-

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Chip Stock

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

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3,070

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ACDS - Activité Composants Distribution Service

France . 44 parts In-Stock

1+ parts

-

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-

1k+ parts

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44

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-

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10 parts In-Stock

1+ parts

-

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-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 807 parts In-Stock

1+ parts

$4.554

100+ parts

-

1k+ parts

-

10k+ parts

-

807

$4.554

-

-

-

Microchip USA

USA . 2,374 parts In-Stock

1+ parts

$19.080

100+ parts

$18.800

1k+ parts

$18.670

10k+ parts

$18.530

2,374

$19.080

$18.800

$18.670

$18.530

AZTECH Wire

Italy . 377 parts In-Stock

1+ parts

$21.770

100+ parts

-

1k+ parts

-

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377

$21.770

-

-

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Parana Technologies

USA . 921 parts In-Stock

1+ parts

$64.556

100+ parts

-

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-

10k+ parts

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921

$64.556

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DigiPath Technology Company

USA . 1,533 parts In-Stock

1+ parts

$71.084

100+ parts

$65.398

1k+ parts

-

10k+ parts

-

1,533

$71.084

$65.398

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ChromeModa Solutions

Germany . 2,894 parts In-Stock

1+ parts

$72.535

100+ parts

$59.479

1k+ parts

-

10k+ parts

-

2,894

$72.535

$59.479

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

1+ parts

$72.535

100+ parts

$68.908

1k+ parts

$65.282

10k+ parts

-

2,317

$72.535

$68.908

$65.282

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Cyclops Electronics Ltd (Excess)

UK . 44 parts In-Stock

1+ parts

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44

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Overview

Unlock the power of innovation with the MSP430F6734IPZ by Texas Instruments, a cutting-edge microcontroller that promises superior quality and reliability. Designed by a trusted manufacturer, this device is ideal for a wide range of applications in various industries. With its advanced technology and high-performance capabilities, customers can expect seamless integration, improved efficiency, and exceptional results. Experience the value and benefits of this top-of-the-line product, and elevate your projects to new heights with ease. Choose the MSP430F6734IPZ and stay ahead of the curve in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power supply systems.

CPU Family: MSP430

Part of a popular and well-supported microcontroller family, ensuring compatibility and support.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities for various applications.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal conversion.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple communication interfaces for versatile connectivity options.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller.

Low Power Mode: YES

Enables energy-efficient operation, extending battery life in portable devices.

Technical Specifications

Microcontrollers MSP430F6734IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6734IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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