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MSP430F6734IPNR

Texas Instruments

MSP430F6734IPNR by Texas Instruments

MSP430F6734IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 0.05 MHz. It features 5-Ch 10-Bit ADC channels and 3 DMA channels, suitable for industrial applications requiring low power consumption and high-speed data processing. With a wide temperature range of -40 to 85 °C, it offers versatile connectivity options like I2C, SPI, and UART for efficient communication protocols.

Median Price

$4.089

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$3.230

100+ parts

$3.170

1k+ parts

$3.100

10k+ parts

-

2,000

$3.230

$3.170

$3.100

-

Texas Instruments

USA . 25,923 parts In-Stock

1+ parts

$4.948

100+ parts

$4.034

1k+ parts

$2.689

10k+ parts

-

25,923

$4.948

$4.034

$2.689

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 613 parts In-Stock

1+ parts

$4.701

100+ parts

-

1k+ parts

-

10k+ parts

-

613

$4.701

-

-

-

Vyrian

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,940 parts In-Stock

1+ parts

$4.453

100+ parts

-

1k+ parts

-

10k+ parts

-

2,940

$4.453

-

-

-

AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$15.420

100+ parts

-

1k+ parts

-

10k+ parts

-

771

$15.420

-

-

-

Parana Technologies

USA . 36 parts In-Stock

1+ parts

$69.922

100+ parts

$6,493.315

1k+ parts

$62.930

10k+ parts

-

36

$69.922

$6,493.315

$62.930

-

DigiPath Technology Company

USA . 357 parts In-Stock

1+ parts

$76.993

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$76.993

-

-

-

ChromeModa Solutions

Germany . 4,780 parts In-Stock

1+ parts

$78.564

100+ parts

$64.422

1k+ parts

-

10k+ parts

-

4,780

$78.564

$64.422

-

-

IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$78.564

100+ parts

$74.636

1k+ parts

$70.708

10k+ parts

-

2,016

$78.564

$74.636

$70.708

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F6734IPNR microcontroller! Designed with precision and quality in mind, this versatile device offers unparalleled performance for a wide range of applications. From smart home automation to industrial control systems, the MSP430F6734IPNR delivers superior functionality and reliability. With advanced features like multiple ADC channels, DMA support, and low power modes, this microcontroller is the perfect choice for your next project. Experience the difference with Texas Instruments - where cutting-edge technology meets exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good protection for the microcontroller, making it durable and resistant to physical damage.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power supply options, accommodating a wide range of applications.

Surface Mount: YES

Surface mount capability enables easy and efficient integration onto circuit boards, saving space and reducing assembly time.

No. of I/O Lines: 72

With 72 I/O lines, this microcontroller offers extensive connectivity options for interfacing with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of code, making it convenient for development and testing.

Technical Specifications

Microcontrollers MSP430F6734IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6734IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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