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MSP430F6734AIPN

Texas Instruments

MSP430F6734AIPN by Texas Instruments

MSP430F6734AIPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, and RTC, it offers versatile connectivity options including I2C and SPI interfaces.

Median Price

$6.598

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,186 parts In-Stock

1+ parts

$6.598

100+ parts

$5.379

1k+ parts

$3.586

10k+ parts

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19,186

$6.598

$5.379

$3.586

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 164 parts In-Stock

1+ parts

$6.268

100+ parts

-

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164

$6.268

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Vyrian

USA . 9,317 parts In-Stock

1+ parts

-

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9,317

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,475 parts In-Stock

1+ parts

$5.938

100+ parts

-

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4,475

$5.938

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AZTECH Wire

Italy . 1,105 parts In-Stock

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$19.350

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1,105

$19.350

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Parana Technologies

USA . 1,406 parts In-Stock

1+ parts

$60.199

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1,406

$60.199

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DigiPath Technology Company

USA . 671 parts In-Stock

1+ parts

$66.286

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671

$66.286

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ChromeModa Solutions

Germany . 5,969 parts In-Stock

1+ parts

$67.639

100+ parts

$55.464

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5,969

$67.639

$55.464

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$67.639

100+ parts

$64.257

1k+ parts

$60.875

10k+ parts

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1,871

$67.639

$64.257

$60.875

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6734AIPN microcontroller! Crafted with precision and expertise, this powerful device offers unparalleled value and benefits to customers across various applications. Whether you're diving into IoT projects, automotive designs, or consumer electronics, the MSP430F6734AIPN delivers exceptional performance and reliability. Say goodbye to limitations and hello to innovation with this cutting-edge microcontroller from a trusted industry leader. Elevate your projects and unleash your creativity with the Texas Instruments MSP430F6734AIPN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more power to be delivered to the microcontroller, enabling it to handle more tasks efficiently.

Bit Size: 16

Having a larger bit size allows for more complex calculations and operations to be performed by the microcontroller.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interact with the analog world, making it versatile in various applications.

Maximum Clock Frequency: 25 MHz

Higher clock frequency means faster processing speed, making the microcontroller suitable for applications requiring real-time data processing.

RAM Bytes: 4096

Having a larger RAM allows the microcontroller to store and access more data quickly, enhancing its multitasking capabilities.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple connectivity options make it easier to interface the microcontroller with different peripherals and communication protocols, enhancing its compatibility.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, making it flexible for firmware updates and modifications.

Low Power Mode: YES

Low power consumption in standby or idle mode prolongs battery life and reduces overall power usage, making the microcontroller energy-efficient.

Technical Specifications

Microcontrollers MSP430F6734AIPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6734AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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