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MSP430F6733AIPZR

Texas Instruments

MSP430F6733AIPZR by Texas Instruments

MSP430F6733AIPZR by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 6 ADC channels, and 3 DMA channels. It operates at a max frequency of 25 MHz and features low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, SPI, and UART.

Median Price

$4.709

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,245 parts In-Stock

1+ parts

$4.709

100+ parts

$3.839

1k+ parts

$2.559

10k+ parts

-

5,245

$4.709

$3.839

$2.559

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,043 parts In-Stock

1+ parts

$4.474

100+ parts

-

1k+ parts

-

10k+ parts

-

4,043

$4.474

-

-

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Vyrian

USA . 5,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,774

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,426 parts In-Stock

1+ parts

$4.238

100+ parts

-

1k+ parts

-

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4,426

$4.238

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-

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AZTECH Wire

Italy . 77 parts In-Stock

1+ parts

$14.510

100+ parts

-

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10k+ parts

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77

$14.510

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Parana Technologies

USA . 1,096 parts In-Stock

1+ parts

$22.901

100+ parts

-

1k+ parts

$23.559

10k+ parts

-

1,096

$22.901

-

$23.559

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IDEA Electronic Components Group

UK . 2,299 parts In-Stock

1+ parts

$25.731

100+ parts

$24.444

1k+ parts

$23.158

10k+ parts

-

2,299

$25.731

$24.444

$23.158

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ChromeModa Solutions

Germany . 1,897 parts In-Stock

1+ parts

$25.731

100+ parts

$21.099

1k+ parts

-

10k+ parts

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1,897

$25.731

$21.099

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Component Stockers USA

USA . 1,477 parts In-Stock

1+ parts

$55.170

100+ parts

-

1k+ parts

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1,477

$55.170

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

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100+ parts

$23.199

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1,862

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$23.199

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6733AIPZR microcontroller. Designed with precision and reliability in mind, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features such as multiple ADC channels, DMA support, and low power modes. Whether you're developing IoT devices, industrial automation systems, or consumer electronics, the MSP430F6733AIPZR delivers the performance and flexibility you need to bring your ideas to life. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it suitable for a wide range of applications.

Package Shape: SQUARE

Helps in efficient use of space on the circuit board, ideal for compact designs.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, increasing the versatility of the microcontroller.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and low-profile design, important for space-constrained applications.

Minimum Supply Voltage: 2.4 V

Allows operation at lower voltages, saving power and improving efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

CPU Family: MSP430

Belongs to a reputable CPU family known for its reliability and performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in very low temperatures, ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated analog-to-digital converters allow for interfacing with analog sensors and signals.

DMA Channels: YES

Direct memory access channels enable efficient data transfer without CPU intervention, improving performance.

Terminal Position: QUAD

Quad terminal position provides stability and mechanical support on the circuit board.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low profile design reduces overall height of the microcontroller, crucial for slim devices.

Width: 14 mm

Compact width enables placement in tight spaces, contributing to a smaller overall footprint.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging during manufacturing and maintenance.

Peripherals: BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Rich set of peripherals enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast execution of instructions, essential for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands reflow soldering processes for reliable assembly onto circuit boards.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during manufacturing without damage.

Length: 14 mm

Compact length contributes to a space-saving design, crucial for miniaturized products.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, suitable for harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing, making the microcontroller suitable for a wide range of applications.

RAM Bytes: 4096

Adequate RAM capacity for storing and accessing data during operations, improving performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections on the circuit board.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals.

Maximum Supply Current: 9.54 mA

Low supply current consumption for energy-efficient operation, suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

No. of DMA Channels: 3

Multiple DMA channels for efficient data transfer and processing, enhancing overall system performance.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog output signals.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Various communication interfaces enable seamless connectivity with external devices and systems.

ROM Programmability: FLASH

Flash ROM allows for easy and flexible programming of the microcontroller for different applications.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for denser packing on the circuit board, saving space and improving connectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the level of protection against moisture during storage and handling.

Speed: 25 rpm

Can operate at a speed of 25 revolutions per minute, suitable for applications requiring precise timing.

Low Power Mode: YES

Includes low power mode for energy-saving operation, extending battery life in portable devices.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM for storing program instructions efficiently.

No. of I/O Lines: 72

Provides numerous input/output lines for interfacing with external components, sensors, and peripherals.

Technical Specifications

Microcontrollers MSP430F6733AIPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6733AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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