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MSP430F6733AIPZ

Texas Instruments

MSP430F6733AIPZ by Texas Instruments

MSP430F6733AIPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 6 ADC channels, and 3 DMA channels. It operates at a max frequency of 25 MHz and features low power mode for industrial applications requiring high-speed processing in compact designs.

Median Price

$6.626

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,708 parts In-Stock

1+ parts

$6.626

100+ parts

$5.402

1k+ parts

$3.601

10k+ parts

-

3,708

$6.626

$5.402

$3.601

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,047 parts In-Stock

1+ parts

$6.295

100+ parts

-

1k+ parts

-

10k+ parts

-

3,047

$6.295

-

-

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Vyrian

USA . 2,941 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2,941

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 591 parts In-Stock

1+ parts

$5.963

100+ parts

-

1k+ parts

-

10k+ parts

-

591

$5.963

-

-

-

Microchip USA

USA . 2,127 parts In-Stock

1+ parts

$18.130

100+ parts

$17.870

1k+ parts

$17.740

10k+ parts

$17.610

2,127

$18.130

$17.870

$17.740

$17.610

AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$22.120

100+ parts

-

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-

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807

$22.120

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Parana Technologies

USA . 804 parts In-Stock

1+ parts

$72.590

100+ parts

$6,741.099

1k+ parts

$65.331

10k+ parts

-

804

$72.590

$6,741.099

$65.331

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DigiPath Technology Company

USA . 195 parts In-Stock

1+ parts

$79.931

100+ parts

$73.536

1k+ parts

-

10k+ parts

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195

$79.931

$73.536

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ChromeModa Solutions

Germany . 3,226 parts In-Stock

1+ parts

$81.562

100+ parts

$66.881

1k+ parts

-

10k+ parts

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3,226

$81.562

$66.881

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$81.562

100+ parts

$77.484

1k+ parts

$73.406

10k+ parts

-

1,096

$81.562

$77.484

$73.406

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Overview

Unlock the potential of your next project with the MSP430F6733AIPZ microcontroller from Texas Instruments. Designed with cutting-edge technology and high-quality materials, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as multiple ADC channels, DMA channels, and PWM channels. With its low power mode and flash ROM programmability, this product provides exceptional value and efficiency for customers looking to optimize their designs. Trust in Texas Instruments to deliver innovation and excellence with the MSP430F6733AIPZ microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making it ideal for mass production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting onto PCBs, optimizing space utilization.

Bit Size: 16

The 16-bit architecture allows for enhanced processing capabilities, ideal for handling complex tasks efficiently.

No. of Terminals: 100

The large number of terminals provides ample connection points for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits, crucial for compact electronic designs.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures operation in power-constrained environments while maintaining performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in demanding industrial environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it suitable for battery-operated devices.

Technical Specifications

Microcontrollers MSP430F6733AIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6733AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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