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MSP430F6733AIPNR

Texas Instruments

MSP430F6733AIPNR by Texas Instruments

MSP430F6733AIPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, and RTC, it offers versatile connectivity through I2C, SPI, and UART interfaces.

Median Price

$4.617

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 77,651 parts In-Stock

1+ parts

$4.617

100+ parts

$3.764

1k+ parts

$2.509

10k+ parts

-

77,651

$4.617

$3.764

$2.509

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,764 parts In-Stock

1+ parts

$4.386

100+ parts

-

1k+ parts

-

10k+ parts

-

2,764

$4.386

-

-

-

Bristol Electronics

USA . 25,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,652

-

-

-

-

Vyrian

USA . 5,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,536

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 930 parts In-Stock

1+ parts

$4.155

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$4.155

-

-

-

AZTECH Wire

Italy . 1,001 parts In-Stock

1+ parts

$17.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,001

$17.750

-

-

-

Microchip USA

USA . 2,285 parts In-Stock

1+ parts

$22.240

100+ parts

$22.100

1k+ parts

$22.030

10k+ parts

$21.960

2,285

$22.240

$22.100

$22.030

$21.960

Parana Technologies

USA . 33 parts In-Stock

1+ parts

$54.924

100+ parts

-

1k+ parts

-

10k+ parts

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33

$54.924

-

-

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$61.712

100+ parts

$58.626

1k+ parts

$55.541

10k+ parts

-

1,733

$61.712

$58.626

$55.541

-

ChromeModa Solutions

Germany . 1,360 parts In-Stock

1+ parts

$61.712

100+ parts

$50.604

1k+ parts

-

10k+ parts

-

1,360

$61.712

$50.604

-

-

Infinite Electronics LLP (Excess)

. 25,655 parts In-Stock

1+ parts

-

100+ parts

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25,655

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DigiPath Technology Company

USA . 1,995 parts In-Stock

1+ parts

-

100+ parts

$55.640

1k+ parts

-

10k+ parts

-

1,995

-

$55.640

-

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6733AIPNR microcontroller. Designed to meet the highest standards of quality and reliability, this innovative product offers a wide range of applications in various industries. With its advanced features and exceptional performance, customers can benefit from increased efficiency, lower power consumption, and seamless connectivity. Trust Texas Instruments to deliver superior products that exceed expectations and elevate your projects to new heights. Experience the difference with the MSP430F6733AIPNR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and compact assembly on PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, offering flexibility in design.

Bit Size: 16

16-bit processing capability provides higher computational power and precision for complex applications.

No. of Terminals: 80

Provides a sufficient number of connectivity options for interfacing with external devices and peripherals.

Minimum Supply Voltage: 2.4 V

Can operate at low power supply voltages, enabling energy-efficient performance.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial and automotive environments.

CPU Family: MSP430

Belongs to a reputable and reliable microcontroller family known for low power consumption and high performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making the microcontroller suitable for real-time applications.

RAM Bytes: 4096

Offers a sufficient amount of random-access memory for data storage and manipulation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making the microcontroller suitable for real-time applications.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple communication interfaces allow for easy integration with various devices and systems.

Technical Specifications

Microcontrollers MSP430F6733AIPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6733AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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