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MSP430F6731IPZ

Texas Instruments

MSP430F6731IPZ by Texas Instruments

MSP430F6731IPZ by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 2/3.3V power supplies, and 85°C max operating temp. Ideal for industrial applications, it features 5-Ch 10-Bit ADCs, low power mode, and connectivity options like I2C and SPI.

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,239 parts In-Stock

1+ parts

$3.490

100+ parts

$3.420

1k+ parts

$3.350

10k+ parts

-

2,239

$3.490

$3.420

$3.350

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 180 parts In-Stock

1+ parts

$9.520

100+ parts

$4.125

1k+ parts

$3.903

10k+ parts

-

180

$9.520

$4.125

$3.903

-

Vyrian

USA . 3,924 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,924

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-

-

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Digiode

USA . 2,796 parts In-Stock

1+ parts

-

100+ parts

-

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2,796

-

-

-

-

Dan-Mar Components

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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180

-

-

-

-

LWI Electronics Inc

India . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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96

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

-

10k+ parts

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719

$5.390

-

-

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One Stop Electronics

USA . 487 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

-

10k+ parts

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487

$33.000

-

-

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Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

$66.753

100+ parts

-

1k+ parts

-

10k+ parts

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2,041

$66.753

-

-

-

DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$73.503

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$73.503

-

-

-

IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$75.003

100+ parts

$71.253

1k+ parts

$67.503

10k+ parts

-

1,500

$75.003

$71.253

$67.503

-

ChromeModa Solutions

Germany . 1,150 parts In-Stock

1+ parts

$75.003

100+ parts

$61.502

1k+ parts

-

10k+ parts

-

1,150

$75.003

$61.502

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

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-

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Infinite Electronics LLP (Excess)

. 1,753 parts In-Stock

1+ parts

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1,753

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Corphita

USA . 1,688 parts In-Stock

1+ parts

-

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1,688

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Microchip USA

USA . 269 parts In-Stock

1+ parts

-

100+ parts

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269

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Cyclops Electronics Ltd (Excess)

UK . 43 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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43

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Overview

Elevate your projects with the Texas Instruments MSP430F6731IPZ microcontroller. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The MSP430F6731IPZ offers unmatched value with its versatile applications in various industries. With features like low power mode, multiple timers, and a wide range of connectivity options, this microcontroller enables seamless integration and optimal performance. Trust Texas Instruments for superior technology and innovation to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to external elements, making the product suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a variety of electronic systems.

ADC Channels: YES

Integration of Analog to Digital Converters allows for efficient conversion of analog signals to digital data for processing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and processing speed, making the microcontroller suitable for a wide range of applications.

Connectivity: "I2C, IRDA(3), SPI(4), UART(3)

Multiple connectivity options enable seamless communication with other devices and peripherals, enhancing the versatility of the product.

Technical Specifications

Microcontrollers MSP430F6731IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6731IPZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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