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MSP430F6731IPNR

Texas Instruments

MSP430F6731IPNR by Texas Instruments

MSP430F6731IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 0.05 MHz. It features 5-Ch 10-Bit ADC channels and 3 DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, RTC, and UART(3), it offers versatile connectivity options for various embedded systems.

Median Price

$4.272

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,966 parts In-Stock

1+ parts

$4.272

100+ parts

$3.483

1k+ parts

$2.322

10k+ parts

-

6,966

$4.272

$3.483

$2.322

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,524 parts In-Stock

1+ parts

$4.058

100+ parts

-

1k+ parts

-

10k+ parts

-

3,524

$4.058

-

-

-

Vyrian

USA . 5,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,876

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,851 parts In-Stock

1+ parts

$3.845

100+ parts

-

1k+ parts

-

10k+ parts

-

2,851

$3.845

-

-

-

AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$13.690

100+ parts

-

1k+ parts

-

10k+ parts

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766

$13.690

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-

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Parana Technologies

USA . 1,489 parts In-Stock

1+ parts

$61.273

100+ parts

-

1k+ parts

-

10k+ parts

-

1,489

$61.273

-

-

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ChromeModa Solutions

Germany . 4,545 parts In-Stock

1+ parts

$68.846

100+ parts

$56.454

1k+ parts

-

10k+ parts

-

4,545

$68.846

$56.454

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-

IDEA Electronic Components Group

UK . 649 parts In-Stock

1+ parts

$68.846

100+ parts

$65.404

1k+ parts

$61.961

10k+ parts

-

649

$68.846

$65.404

$61.961

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DigiPath Technology Company

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$62.072

1k+ parts

-

10k+ parts

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315

-

$62.072

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6731IPNR microcontroller. Built with cutting-edge technology, this device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this versatile microcontroller provides unmatched value and benefits to customers. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects to new heights with the MSP430F6731IPNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for flexibility in power requirements and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

Provides sufficient memory for data storage and processing, improving overall performance.

Bit Size: 16

Larger bit size allows for more complex operations and calculations, enhancing the capabilities of the microcontroller.

Power Supplies (V): 2/3.3

Dual power supply options offer versatility and compatibility with different voltage requirements.

No. of Terminals: 80

Abundance of terminals allows for easy connectivity with external components and peripherals, enhancing functionality.

Minimum Supply Voltage: 2.4 V

Lower minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in elevated temperature conditions.

CPU Family: MSP430

Belonging to the MSP430 family indicates high performance, low power consumption, and extensive features for various applications.

Technical Specifications

Microcontrollers MSP430F6731IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6731IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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