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MSP430F6730IPN

Texas Instruments

MSP430F6730IPN by Texas Instruments

MSP430F6730IPN by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It features 5-Ch 10-Bit ADC channels, 3 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART interfaces.

Median Price

$5.192

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,087 parts In-Stock

1+ parts

$5.192

100+ parts

$4.233

1k+ parts

$2.822

10k+ parts

-

2,087

$5.192

$4.233

$2.822

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,866 parts In-Stock

1+ parts

$4.932

100+ parts

-

1k+ parts

-

10k+ parts

-

2,866

$4.932

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Vyrian

USA . 7,144 parts In-Stock

1+ parts

-

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-

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10k+ parts

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7,144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,708 parts In-Stock

1+ parts

$4.673

100+ parts

-

1k+ parts

-

10k+ parts

-

4,708

$4.673

-

-

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AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$14.390

100+ parts

-

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10k+ parts

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499

$14.390

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Parana Technologies

USA . 439 parts In-Stock

1+ parts

$63.346

100+ parts

-

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439

$63.346

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-

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ChromeModa Solutions

Germany . 1,338 parts In-Stock

1+ parts

$71.175

100+ parts

$58.364

1k+ parts

-

10k+ parts

-

1,338

$71.175

$58.364

-

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IDEA Electronic Components Group

UK . 1,237 parts In-Stock

1+ parts

$71.175

100+ parts

$67.616

1k+ parts

$64.058

10k+ parts

-

1,237

$71.175

$67.616

$64.058

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Component Stockers USA

USA . 2,348 parts In-Stock

1+ parts

-

100+ parts

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2,348

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DigiPath Technology Company

USA . 1,298 parts In-Stock

1+ parts

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100+ parts

$64.171

1k+ parts

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1,298

-

$64.171

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430F6730IPN microcontroller, a game-changer in the world of electronics. Crafted with precision and expertise, this powerful device boasts unparalleled performance and reliability. From smart appliances to wearable technology, this innovative microcontroller is the key to transforming your designs into reality. Embrace the future of technology with the MSP430F6730IPN and experience efficiency like never before. Elevate your projects and exceed expectations with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient mounting on PCBs, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a high supply voltage, providing flexibility and compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Having a wide data RAM width enhances the processing capability and efficiency of the microcontroller.

Package Shape: SQUARE

Square package shape is space-efficient and helps in achieving a compact overall design for the product.

Bit Size: 16

A 16-bit architecture allows for higher computational power and precision in handling data and instructions.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling compatibility with various systems and voltage requirements.

No. of Terminals: 80

Having a high number of terminals offers extensive connectivity options and versatility in interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style ensures a slim profile, efficient heat dissipation, and precise alignment during assembly.

Minimum Supply Voltage: 2.4 V

Supports a low supply voltage, enhancing energy efficiency and allowing operation in battery-powered applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial and harsh environment applications.

CPU Family: MSP430

Part of the MSP430 family known for its low power consumption, high performance, and integration of peripherals for efficient system design.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures, ensuring reliable performance in diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity, corrosion resistance, and reliability in electrical connections.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, supporting sensor interfacing and data acquisition in the microcontroller.

DMA Channels: YES

DMA channels enhance data transfer speed and efficiency, enabling high-performance data processing and communication tasks.

Terminal Position: QUAD

Quad terminal positioning aids in efficient PCB layout and assembly, optimizing space utilization and electrical connections.

ROM Words: 16384

Large ROM capacity allows storing a significant amount of program data, instructions, and firmware, enabling complex operations.

Maximum Seated Height: 1.6 mm

Low seated height facilitates slim and compact device designs, ensuring minimal space requirements and effective heat dissipation.

Width: 12 mm

The compact width allows for space-efficient integration into electronic systems and devices, optimizing PCB layout and design.

Boundary Scan: YES

Boundary scan capability simplifies testing, debugging, and production testing processes, enhancing product reliability and quality.

Peripherals: BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

A wide range of peripherals enhances functionality and connectivity options, enabling versatile applications and system capabilities.

Maximum Clock Frequency: 0.05 MHz

The high clock frequency supports efficient processing speed and real-time operation, suitable for demanding computational tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for extended durations, ensuring reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during soldering, ensuring robust assembly and connection reliability.

Length: 12 mm

Compact length allows for flexible placement and integration within electronic systems, optimizing space utilization and design flexibility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environmental conditions and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making it suitable for high-performance embedded systems and applications.

No. of Timers: 4

Multiple timers support precise timing control, event scheduling, and synchronization, enhancing system functionality and performance.

RAM Bytes: 1024

Ample RAM capacity allows for efficient data storage, processing, and multitasking, supporting complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, enhancing energy efficiency and system reliability.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections, mechanical strength, and ease of assembly, ensuring reliable electrical contacts.

Analog To Digital Convertors: 5-Ch 10-Bit

Integrated ADC channels with multiple input channels and high resolution support analog signal processing and conversion for sensor interfacing.

Maximum Supply Current: 9.54 mA

Low supply current consumption enhances energy efficiency and prolongs battery life in portable and low-power applications.

Nominal Supply Voltage: 3 V

Stable supply voltage ensures consistent performance and reliable operation, supporting various electronic system requirements.

No. of DMA Channels: 3

Multiple DMA channels enable efficient data transfer and processing, reducing CPU overhead and enhancing system performance.

No. of Serial I/Os: 4

Multiple serial I/O interfaces enable seamless communication with external devices, supporting versatile connectivity options.

PWM Channels: YES

PWM channels allow for precise control of analog outputs and motor speed regulation, enhancing system versatility and functionality.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple connectivity options enable seamless integration with various communication protocols and devices, enhancing system compatibility.

ROM Programmability: FLASH

Flash programmable ROM offers flexibility for firmware updates and program modifications, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for efficient PCB layout, miniaturization, and high-density connectors, optimizing space utilization.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations, reduces computational complexity, and enhances processing efficiency in numerical calculations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level ensures safe handling, storage, and reflow soldering, maintaining product quality and reliability.

Speed: 25 rpm

High speed capability supports rapid data processing and system performance, suitable for real-time control and high-speed applications.

Low Power Mode: YES

Low power mode enhances energy efficiency and extends battery life, suitable for power-sensitive applications and portable devices.

On Chip Program ROM Width: 8

Wide on-chip program ROM width enables efficient storage and execution of program instructions, supporting complex algorithms.

No. of I/O Lines: 72

Abundant I/O lines offer extensive interfacing options with external components, sensors, and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers MSP430F6730IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6730IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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