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MSP430F6730AIPNR

Texas Instruments

MSP430F6730AIPNR by Texas Instruments

MSP430F6730AIPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, and RTC, it offers versatile connectivity through I2C, SPI, and UART interfaces.

Median Price

$3.874

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,530 parts In-Stock

1+ parts

$3.874

100+ parts

$3.395

1k+ parts

$1.918

10k+ parts

-

2,530

$3.874

$3.395

$1.918

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,520 parts In-Stock

1+ parts

$3.680

100+ parts

-

1k+ parts

-

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2,520

$3.680

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-

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Vyrian

USA . 3,328 parts In-Stock

1+ parts

-

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-

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-

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3,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,597 parts In-Stock

1+ parts

$3.487

100+ parts

-

1k+ parts

-

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2,597

$3.487

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AZTECH Wire

Italy . 87 parts In-Stock

1+ parts

$9.810

100+ parts

-

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87

$9.810

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Microchip USA

USA . 1,847 parts In-Stock

1+ parts

$17.630

100+ parts

$17.520

1k+ parts

$17.470

10k+ parts

$17.410

1,847

$17.630

$17.520

$17.470

$17.410

Parana Technologies

USA . 497 parts In-Stock

1+ parts

$37.806

100+ parts

-

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-

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497

$37.806

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DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$41.629

100+ parts

-

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1,453

$41.629

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ChromeModa Solutions

Germany . 2,723 parts In-Stock

1+ parts

$42.479

100+ parts

$34.833

1k+ parts

-

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2,723

$42.479

$34.833

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IDEA Electronic Components Group

UK . 1,869 parts In-Stock

1+ parts

$42.479

100+ parts

$40.355

1k+ parts

$38.231

10k+ parts

-

1,869

$42.479

$40.355

$38.231

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Component Stockers USA

USA . 1,968 parts In-Stock

1+ parts

$57.110

100+ parts

-

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1,968

$57.110

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Overview

Unlock the full potential of your projects with the Texas Instruments MSP430F6730AIPNR microcontroller. Designed with precision and quality in mind, this powerful device offers a wide range of applications for any project. From its innovative technology to its durable design, Texas Instruments guarantees reliability and performance. With features like low power modes, multiple PWM channels, and advanced connectivity options, this microcontroller provides unmatched value and benefits to customers looking to take their projects to the next level. Choose Texas Instruments for superior quality and unleash endless possibilities with the MSP430F6730AIPNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape offers uniformity and ease of placement within a PCB layout.

Bit Size: 16

Offers a good balance between computational power and efficiency for various applications.

No. of Terminals: 80

Sufficient number of terminals for a wide range of input/output connections and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style allows for compact design and efficient use of space on the PCB.

Minimum Supply Voltage: 2.4 V

Can operate at low voltages, enabling energy-efficient designs.

Maximum Operating Temperature: 85 °C

Capable of functioning in high-temperature environments, ensuring reliability in various conditions.

CPU Family: MSP430

MSP430 family is known for its low power consumption and versatile peripherals, making it a popular choice for embedded applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, suitable for a wide range of applications.

Technical Specifications

Microcontrollers MSP430F6730AIPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6730AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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