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MSP430F6726AIPZR

Texas Instruments

MSP430F6726AIPZR by Texas Instruments

MSP430F6726AIPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 6-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT peripherals and operates at a max frequency of 25 MHz.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32,175 parts In-Stock

1+ parts

$4.760

100+ parts

$3.881

1k+ parts

$2.587

10k+ parts

-

32,175

$4.760

$3.881

$2.587

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,048 parts In-Stock

1+ parts

$4.522

100+ parts

-

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-

10k+ parts

-

3,048

$4.522

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-

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Vyrian

USA . 5,822 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,822

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,794 parts In-Stock

1+ parts

$4.284

100+ parts

-

1k+ parts

-

10k+ parts

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2,794

$4.284

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$14.720

100+ parts

-

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-

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39

$14.720

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Parana Technologies

USA . 498 parts In-Stock

1+ parts

$58.985

100+ parts

-

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-

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498

$58.985

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-

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DigiPath Technology Company

USA . 461 parts In-Stock

1+ parts

$64.950

100+ parts

$59.754

1k+ parts

-

10k+ parts

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461

$64.950

$59.754

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-

IDEA Electronic Components Group

UK . 2,213 parts In-Stock

1+ parts

$66.275

100+ parts

$62.961

1k+ parts

$59.648

10k+ parts

-

2,213

$66.275

$62.961

$59.648

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ChromeModa Solutions

Germany . 1,553 parts In-Stock

1+ parts

$66.275

100+ parts

$54.346

1k+ parts

-

10k+ parts

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1,553

$66.275

$54.346

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Component Stockers USA

USA . 32,985 parts In-Stock

1+ parts

-

100+ parts

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32,985

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Overview

Unlock the potential of your electronic devices with the MSP430F6726AIPZR by Texas Instruments. This high-quality microcontroller offers unrivaled performance and reliability, thanks to the expertise of a trusted manufacturer. From industrial automation to consumer electronics, this versatile device is perfect for a wide range of applications. Experience the value and benefits of seamless connectivity, low power consumption, and advanced features that will take your projects to the next level. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and cost-effective for mass production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for flexibility in power supply options.

Bit Size: 16

A 16-bit architecture offers higher computational power and efficiency compared to lower bit sizes.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion without requiring additional external components.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller provides efficient processing and reduced power consumption for better performance.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently store and process data for various applications.

Speed: 25 rpm

Operating at a speed of 25 rpm allows for fast and responsive execution of tasks in real-time applications.

Low Power Mode: YES

The availability of a low power mode helps conserve energy and extend battery life in portable devices.

Technical Specifications

Microcontrollers MSP430F6726AIPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6726AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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