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MSP430F6725IPNR

Texas Instruments

MSP430F6725IPNR by Texas Instruments

MSP430F6725IPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 4096 RAM bytes. It features 5-Ch 10-Bit ADC channels, 3 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART interfaces.

Median Price

$4.948

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,216 parts In-Stock

1+ parts

$4.948

100+ parts

$4.034

1k+ parts

$2.689

10k+ parts

-

7,216

$4.948

$4.034

$2.689

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,462 parts In-Stock

1+ parts

$4.701

100+ parts

-

1k+ parts

-

10k+ parts

-

3,462

$4.701

-

-

-

Vyrian

USA . 4,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,771

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,311 parts In-Stock

1+ parts

$4.453

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$4.453

-

-

-

AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$15.170

100+ parts

-

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-

10k+ parts

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335

$15.170

-

-

-

Parana Technologies

USA . 63 parts In-Stock

1+ parts

$22.305

100+ parts

-

1k+ parts

$22.980

10k+ parts

-

63

$22.305

-

$22.980

-

ChromeModa Solutions

Germany . 2,359 parts In-Stock

1+ parts

$25.062

100+ parts

$20.551

1k+ parts

-

10k+ parts

-

2,359

$25.062

$20.551

-

-

IDEA Electronic Components Group

UK . 680 parts In-Stock

1+ parts

$25.062

100+ parts

$23.809

1k+ parts

$22.556

10k+ parts

-

680

$25.062

$23.809

$22.556

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Microchip USA

USA . 3,753 parts In-Stock

1+ parts

$27.531

100+ parts

-

1k+ parts

-

10k+ parts

-

3,753

$27.531

-

-

-

Component Stockers USA

USA . 4,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.910

10k+ parts

-

4,347

-

-

$2.910

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Futuretech Components

Singapore . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1,500

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DigiPath Technology Company

USA . 1,410 parts In-Stock

1+ parts

-

100+ parts

$22.596

1k+ parts

-

10k+ parts

-

1,410

-

$22.596

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F6725IPNR Microcontroller. Designed with precision and excellence, this cutting-edge product offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers advanced capabilities that exceed expectations. With its low power consumption and high-speed operation, the MSP430F6725IPNR is the ultimate solution for your next project. Experience the quality and value that Texas Instruments brings to the table with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package, making it suitable for various applications.

Surface Mount: YES

Ease of PCB assembly and space-saving design.

Maximum Supply Voltage: 3.6 V

Support for higher voltage applications.

No. of Terminals: 80

Provides ample connectivity options for peripherals and external devices.

ADC Channels: YES

Analog to Digital conversion capability for sensor interfacing.

DMA Channels: YES

Allows efficient data transfer without CPU intervention.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for computing tasks.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal processing.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple communication interfaces for versatile connectivity options.

Speed: 25 rpm

Efficient processing speed for real-time applications.

Technical Specifications

Microcontrollers MSP430F6725IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6725IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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