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MSP430F6724AIPNR

Texas Instruments

MSP430F6724AIPNR by Texas Instruments

MSP430F6724AIPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, 3 ADC channels, and 3 DMA channels. It operates at a max frequency of 25 MHz and features low power mode for industrial applications. With ROM words of 98304 and RAM bytes of 4096, it offers versatile connectivity options like I2C, IRDA(3), SPI(4), UART(3).

Median Price

$4.674

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 63,490 parts In-Stock

1+ parts

$4.674

100+ parts

$3.810

1k+ parts

$2.540

10k+ parts

-

63,490

$4.674

$3.810

$2.540

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,602 parts In-Stock

1+ parts

$4.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,602

$4.440

-

-

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Vyrian

USA . 4,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,393

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,297 parts In-Stock

1+ parts

$4.207

100+ parts

-

1k+ parts

-

10k+ parts

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4,297

$4.207

-

-

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AZTECH Wire

Italy . 122 parts In-Stock

1+ parts

$9.650

100+ parts

-

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-

10k+ parts

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122

$9.650

-

-

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Parana Technologies

USA . 955 parts In-Stock

1+ parts

$36.281

100+ parts

-

1k+ parts

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955

$36.281

-

-

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DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$39.950

100+ parts

-

1k+ parts

-

10k+ parts

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896

$39.950

-

-

-

ChromeModa Solutions

Germany . 5,462 parts In-Stock

1+ parts

$40.765

100+ parts

$33.427

1k+ parts

-

10k+ parts

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5,462

$40.765

$33.427

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IDEA Electronic Components Group

UK . 2,258 parts In-Stock

1+ parts

$40.765

100+ parts

$38.727

1k+ parts

$36.688

10k+ parts

-

2,258

$40.765

$38.727

$36.688

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Component Stockers USA

USA . 15,992 parts In-Stock

1+ parts

-

100+ parts

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15,992

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Overview

Elevate your projects with the Texas Instruments MSP430F6724AIPNR microcontroller, designed to deliver superior performance and reliability. With a proven track record of excellence, Texas Instruments ensures top-notch quality in every component they manufacture. Ideal for a wide range of applications, this microcontroller offers unparalleled value to customers looking for innovative solutions. Experience the benefits of efficient power consumption, versatile connectivity options, and advanced peripherals that set this product apart from the rest. Upgrade your designs with the MSP430F6724AIPNR and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Bit Size: 16

Provides sufficient processing power for a wide range of applications, striking a balance between performance and cost.

ADC Channels: YES

Allows for analog signals to be converted into digital data for processing, expanding the range of inputs the microcontroller can handle.

ROM Words: 98304

Ample storage space for program instructions and data, enabling complex algorithms and applications to be implemented.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, ensuring consistent performance under varying conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and control, optimizing performance and power consumption.

RAM Bytes: 4096

Adequate memory for storing and manipulating data during program execution, enabling efficient processing of instructions.

Analog To Digital Convertors: 3-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate conversion of analog signals into digital form, enhancing sensor interfacing capabilities.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Support for a variety of communication protocols facilitates integration with other devices and peripherals, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers MSP430F6724AIPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6724AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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