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MSP430F6723IPZ

Texas Instruments

MSP430F6723IPZ by Texas Instruments

MSP430F6723IPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 5-Ch 10-Bit ADC, and 4 PWM channels. It operates at a max frequency of 0.05 MHz and is suitable for industrial applications requiring low power consumption. The MCU features BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT peripherals for versatile connectivity via I2C, IRDA(3), SPI(4), UART(3).

Median Price

$7.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,374 parts In-Stock

1+ parts

$2.750

100+ parts

$2.700

1k+ parts

$2.640

10k+ parts

-

7,374

$2.750

$2.700

$2.640

-

Texas Instruments

USA . 2,591 parts In-Stock

1+ parts

$6.160

100+ parts

$5.022

1k+ parts

$3.348

10k+ parts

-

2,591

$6.160

$5.022

$3.348

-

DigiKey

USA . 180 parts In-Stock

1+ parts

$8.040

100+ parts

$5.304

1k+ parts

-

10k+ parts

-

180

$8.040

$5.304

-

-

Mouser Electronics

USA . 148 parts In-Stock

1+ parts

$8.040

100+ parts

$5.300

1k+ parts

$4.790

10k+ parts

-

148

$8.040

$5.300

$4.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,330 parts In-Stock

1+ parts

$5.377

100+ parts

-

1k+ parts

-

10k+ parts

-

4,330

$5.377

-

-

-

Vyrian

USA . 2,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,013

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 651 parts In-Stock

1+ parts

$5.094

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$5.094

-

-

-

Parana Technologies

USA . 25 parts In-Stock

1+ parts

$25.720

100+ parts

-

1k+ parts

$26.322

10k+ parts

-

25

$25.720

-

$26.322

-

DigiPath Technology Company

USA . 98 parts In-Stock

1+ parts

$28.321

100+ parts

$26.055

1k+ parts

-

10k+ parts

-

98

$28.321

$26.055

-

-

ChromeModa Solutions

Germany . 6,909 parts In-Stock

1+ parts

$28.899

100+ parts

$23.697

1k+ parts

-

10k+ parts

-

6,909

$28.899

$23.697

-

-

IDEA Electronic Components Group

UK . 1,035 parts In-Stock

1+ parts

$28.899

100+ parts

$27.454

1k+ parts

$26.009

10k+ parts

-

1,035

$28.899

$27.454

$26.009

-

iodParts Technologies Inc.

India . 11,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,880

-

-

-

-

Lixinc

USA . 9,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,743

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F6723IPZ microcontroller. Known for its superior quality and cutting-edge technology, Texas Instruments delivers a versatile solution for a wide range of applications. With features like low power mode, multiple connectivity options, and on-chip peripherals, this microcontroller offers unmatched value to customers seeking high performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F6723IPZ is the perfect choice to bring your projects to life. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

CPU Family: MSP430

Being part of the MSP430 family means it has advanced features and capabilities, making it a reliable choice for complex applications.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple ADC channels with 10-bit resolution provide accurate analog to digital conversion, essential for many applications requiring precise measurements.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Various connectivity options such as I2C, IRDA, SPI, and UART make it versatile and easily integrable into different communication protocols.

Low Power Mode: YES

Low power mode functionality helps in reducing power consumption, extending battery life, and making the microcontroller suitable for portable and energy-efficient devices.

Technical Specifications

Microcontrollers MSP430F6723IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6723IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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