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MSP430F6723IPNR

Texas Instruments

MSP430F6723IPNR by Texas Instruments

MSP430F6723IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at a max frequency of 0.05 MHz. It features 5-Ch 10-Bit ADC channels and offers low power mode, suitable for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

$4.232

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,064 parts In-Stock

1+ parts

$4.232

100+ parts

$3.450

1k+ parts

$2.300

10k+ parts

-

36,064

$4.232

$3.450

$2.300

-

Mouser Electronics

USA . 576 parts In-Stock

1+ parts

$7.560

100+ parts

$4.760

1k+ parts

$3.590

10k+ parts

-

576

$7.560

$4.760

$3.590

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.735

10k+ parts

$2.716

2,000

-

-

$2.735

$2.716

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

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-

62

$3.540

-

-

-

Digiode

USA . 2,561 parts In-Stock

1+ parts

$4.020

100+ parts

-

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2,561

$4.020

-

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Chip Stock

USA . 89,000 parts In-Stock

1+ parts

-

100+ parts

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89,000

-

-

-

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ComSIT Distribution GmbH

Germany . 25,000 parts In-Stock

1+ parts

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100+ parts

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25,000

-

-

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Vyrian

USA . 6,919 parts In-Stock

1+ parts

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6,919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,894 parts In-Stock

1+ parts

$2.320

100+ parts

-

1k+ parts

-

10k+ parts

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12,894

$2.320

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.540

100+ parts

$3.469

1k+ parts

-

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2,000

$3.540

$3.469

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Corphita

USA . 2,377 parts In-Stock

1+ parts

$3.809

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-

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2,377

$3.809

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Microchip USA

USA . 3,699 parts In-Stock

1+ parts

$23.550

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3,699

$23.550

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Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$25.782

100+ parts

-

1k+ parts

$26.387

10k+ parts

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1,429

$25.782

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$26.387

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ChromeModa Solutions

Germany . 4,753 parts In-Stock

1+ parts

$28.968

100+ parts

$23.754

1k+ parts

-

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4,753

$28.968

$23.754

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

1+ parts

$28.968

100+ parts

$27.520

1k+ parts

$26.071

10k+ parts

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1,884

$28.968

$27.520

$26.071

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Perfect Parts

USA . 172,480 parts In-Stock

1+ parts

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172,480

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Lixinc

USA . 18,309 parts In-Stock

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18,309

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Futuretech Components

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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DigiPath Technology Company

USA . 1,566 parts In-Stock

1+ parts

-

100+ parts

$26.118

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1,566

-

$26.118

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

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iodParts Technologies Inc.

India . 50 parts In-Stock

1+ parts

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50

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F6723IPNR microcontroller. Known for its high quality and reliability, Texas Instruments continues to be a leader in the industry. This microcontroller offers a wide range of applications in various fields, providing customers with exceptional value and benefits. From low power modes to multiple peripherals, this product delivers outstanding performance, making it the ideal choice for your next innovative design. Experience the advantages of Texas Instruments technology with the MSP430F6723IPNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options for different applications.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage on the chip.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and component placement, optimizing board space usage.

Bit Size: 16

16-bit architecture enables higher processing capabilities and performance compared to lower bit architectures.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for compatibility with various power sources and system requirements.

No. of Terminals: 80

Having 80 terminals provides ample I/O options for connecting to external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and enhances thermal performance.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial environments with variable temperature conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its energy efficiency, making the microcontroller a great choice for low-power applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to operate reliably in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity, corrosion resistance, and reliability in electrical connections.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

DMA Channels: YES

DMA channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position simplifies soldering and rework processes during assembly, reducing manufacturing time and costs.

ROM Words: 65536

The large ROM capacity allows for storing a significant amount of program code and data, enabling complex applications to be implemented.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm saves vertical space in the PCB assembly, especially in compact electronic devices.

RAM Words: 4

The on-chip RAM provides temporary data storage for efficient and fast execution of instructions, improving system performance.

Width: 12 mm

With a width of 12 mm, the microcontroller is compact and can be integrated into small form factor devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the microcontroller during the manufacturing process, enhancing product quality and reliability.

Peripherals: 'BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT'

The variety of peripherals available enhances the microcontroller's functionality and enables it to interface with a wide range of external devices and sensors.

Maximum Clock Frequency: 0.05 MHz

The high maximum clock frequency of 0.05 MHz allows for fast execution of instructions and high-speed data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow during assembly, reducing the risk of soldering defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable and robust solder joints for long-term durability.

Length: 12 mm

With a length of 12 mm, the microcontroller is compact and space-efficient for placement on a PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller can withstand harsh operating conditions in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers high performance and energy efficiency, making it suitable for a wide range of applications.

No. of Timers: 4

Having four timers allows for precise timing control in various applications such as motor control, signal processing, and synchronization.

RAM Bytes: 4096

The large RAM capacity of 4096 bytes provides ample space for data storage and manipulation, enhancing the microcontroller's processing capabilities.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog circuits.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and improves solder joint reliability, ensuring secure electrical connections.

Analog To Digital Convertors: 5-Ch 10-Bit

The 5-channel 10-bit ADCs enable the microcontroller to convert analog signals into digital data with high resolution and accuracy.

Maximum Supply Current: 9.54 mA

The low maximum supply current of 9.54 mA helps reduce power consumption and extends battery life in battery-operated devices.

Nominal Supply Voltage: 3 V

The 3 V nominal supply voltage provides a common operating voltage for stable and reliable performance across different applications.

No. of DMA Channels: 3

Having 3 DMA channels allows for efficient data transfers and multitasking capabilities, improving overall system performance.

No. of Serial I/Os: 4

The 4 serial I/O interfaces provide versatile communication options for connecting to external devices, peripherals, and networks.

PWM Channels: YES

The support for PWM channels enables the microcontroller to generate precise and variable pulse-width modulation signals for motor control and other applications.

Connectivity: 'I2C, IRDA(3), SPI(4), UART(3)'

The multiple connectivity options (I2C, IRDA, SPI, UART) allow the microcontroller to communicate with a wide range of devices, sensors, and networks.

ROM Programmability: FLASH

Flash ROM programmability allows for convenient and flexible firmware updates, customization, and debugging of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on PCBs, saving board space and accommodating more components.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations, improves computational efficiency, and reduces code complexity in embedded software development.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the microcontroller's resistance to moisture absorption and ensures reliable performance during assembly and operation.

Speed: 25 rpm

The speed of 25 rpm refers to the clock speed of the microcontroller, indicating its processing capabilities and performance for real-time applications.

Technical Specifications

Microcontrollers MSP430F6723IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6723IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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