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MSP430F6723AIPZ

Texas Instruments

MSP430F6723AIPZ by Texas Instruments

MSP430F6723AIPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 6 ADC channels, and 3 DMA channels. It operates at up to 25 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like BOR, LCD, and RTC peripherals, it's ideal for embedded systems design.

Median Price

$6.626

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,787 parts In-Stock

1+ parts

$6.626

100+ parts

$5.402

1k+ parts

$3.601

10k+ parts

-

2,787

$6.626

$5.402

$3.601

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,337 parts In-Stock

1+ parts

$6.295

100+ parts

-

1k+ parts

-

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4,337

$6.295

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Vyrian

USA . 3,915 parts In-Stock

1+ parts

-

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3,915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,531 parts In-Stock

1+ parts

$5.963

100+ parts

-

1k+ parts

-

10k+ parts

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4,531

$5.963

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Microchip USA

USA . 2,285 parts In-Stock

1+ parts

$18.130

100+ parts

$17.870

1k+ parts

$17.740

10k+ parts

$17.610

2,285

$18.130

$17.870

$17.740

$17.610

AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$18.560

100+ parts

-

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1,082

$18.560

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Parana Technologies

USA . 1,815 parts In-Stock

1+ parts

$46.817

100+ parts

-

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10k+ parts

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1,815

$46.817

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ChromeModa Solutions

Germany . 4,293 parts In-Stock

1+ parts

$52.603

100+ parts

$43.134

1k+ parts

-

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4,293

$52.603

$43.134

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IDEA Electronic Components Group

UK . 668 parts In-Stock

1+ parts

$52.603

100+ parts

$49.973

1k+ parts

$47.343

10k+ parts

-

668

$52.603

$49.973

$47.343

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DigiPath Technology Company

USA . 1,626 parts In-Stock

1+ parts

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100+ parts

$47.427

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1,626

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$47.427

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Overview

Uncover the limitless possibilities with the Texas Instruments MSP430F6723AIPZ microcontroller, a true innovation in the field of technology. Designed with precision and reliability in mind, this product offers unparalleled quality and performance. Ideal for a wide range of applications, from consumer electronics to industrial automation, the MSP430F6723AIPZ brings value and efficiency to any project. With advanced features like low power mode and multiple peripherals, this microcontroller provides customers with the tools they need to succeed. Elevate your designs with the MSP430F6723AIPZ, where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

A 16-bit architecture provides enhanced performance and processing capabilities compared to lower bit sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient and fast processing of instructions, making the product suitable for high-performance applications.

Maximum Clock Frequency: 25 MHz

With a high clock frequency, the microcontroller can handle complex tasks and data processing quickly and efficiently.

RAM Bytes: 4096

The ample RAM capacity allows for smooth operation and multitasking without performance bottlenecks.

Analog To Digital Convertors: 6-Ch 10-Bit

Having multiple ADC channels with 10-bit resolution enables precise and accurate analog to digital conversions, essential for sensor interfacing and data acquisition.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Multiple connectivity options such as I2C, IRDA, SPI, and UART provide versatility in communication interfaces for connecting with other devices or systems.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption, extending battery life, and making the product suitable for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F6723AIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6723AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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