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MSP430F6723AIPNR

Texas Instruments

MSP430F6723AIPNR by Texas Instruments

MSP430F6723AIPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$5.908

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 177,948 parts In-Stock

1+ parts

$4.617

100+ parts

$3.764

1k+ parts

$2.509

10k+ parts

-

177,948

$4.617

$3.764

$2.509

-

Mouser Electronics

USA . 848 parts In-Stock

1+ parts

$7.200

100+ parts

$6.120

1k+ parts

$4.480

10k+ parts

-

848

$7.200

$6.120

$4.480

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,601 parts In-Stock

1+ parts

$4.386

100+ parts

-

1k+ parts

-

10k+ parts

-

2,601

$4.386

-

-

-

Vyrian

USA . 8,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,324

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,545 parts In-Stock

1+ parts

$4.155

100+ parts

-

1k+ parts

-

10k+ parts

-

2,545

$4.155

-

-

-

Component Stockers USA

USA . 130,203 parts In-Stock

1+ parts

$5.810

100+ parts

$4.350

1k+ parts

$2.660

10k+ parts

$2.660

130,203

$5.810

$4.350

$2.660

$2.660

Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

$76.436

100+ parts

$7,098.230

1k+ parts

$68.792

10k+ parts

-

1,287

$76.436

$7,098.230

$68.792

-

DigiPath Technology Company

USA . 1,329 parts In-Stock

1+ parts

$84.165

100+ parts

-

1k+ parts

-

10k+ parts

-

1,329

$84.165

-

-

-

ChromeModa Solutions

Germany . 5,023 parts In-Stock

1+ parts

$85.883

100+ parts

$70.424

1k+ parts

-

10k+ parts

-

5,023

$85.883

$70.424

-

-

IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$85.883

100+ parts

$81.589

1k+ parts

$77.295

10k+ parts

-

1,523

$85.883

$81.589

$77.295

-

Lixinc

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,000

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F6723AIPNR microcontroller. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this microcontroller boasts advanced features such as multiple ADC and DMA channels, low power mode, and connectivity options like I2C and SPI. Experience seamless performance and efficiency with the MSP430F6723AIPNR, delivering exceptional value and endless possibilities for your projects. Upgrade your technology game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller components.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Offers a wide range of supply voltage options for versatile applications.

Package Shape: SQUARE

Helps in designing compact and efficient circuit layouts.

Bit Size: 16

High bit size allows for precise and complex calculations.

No. of Terminals: 80

Plenty of terminals for connectivity with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates space-saving and high-density designs.

Minimum Supply Voltage: 2.4 V

Can operate at lower voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high operating temperatures.

CPU Family: MSP430

Belonging to a known CPU family ensures reliability and compatibility.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures long-term reliability.

ADC Channels: YES

Allows for analog-to-digital conversion for precise measurements.

DMA Channels: YES

Facilitates efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position enhances stability and connectivity.

ROM Words: 65536

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim devices.

Width: 12 mm

Narrow width facilitates space-saving layouts.

Boundary Scan: YES

Enables testing and debugging of the microcontroller during production.

Peripherals: BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Several peripherals enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast and efficient processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for manufacturing processes.

Length: 12 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing.

RAM Bytes: 4096

Adequate RAM capacity for storing and manipulating data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections.

Analog To Digital Convertors: 3-Ch 10-Bit

Multiple ADC channels for converting analog signals to digital values.

Maximum Supply Current: 9.54 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

No. of DMA Channels: 3

Multiple DMA channels for efficient data handling and processing.

PWM Channels: YES

Supports pulse-width modulation for precise control of peripherals.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Various connectivity options for interfacing with external devices.

ROM Programmability: FLASH

Flash ROM allows for reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity during storage and handling.

Speed: 25 rpm

Operates at a moderate speed suitable for most applications.

Low Power Mode: YES

Includes low power modes for energy-efficient operation.

On Chip Program ROM Width: 8

8-bit program ROM width for efficient data processing.

No. of I/O Lines: 72

Plenty of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F6723AIPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6723AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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