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MSP430F6721AIPN

Texas Instruments

MSP430F6721AIPN by Texas Instruments

MSP430F6721AIPN by Texas Instruments is a 16-bit microcontroller with 3 ADC channels, 3 DMA channels, and 72 I/O lines. It operates at a max clock frequency of 25 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, SPI, and UART.

Median Price

$7.674

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,963 parts In-Stock

1+ parts

$5.697

100+ parts

$4.644

1k+ parts

$3.096

10k+ parts

-

2,963

$5.697

$4.644

$3.096

-

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$9.650

100+ parts

$6.900

1k+ parts

$5.120

10k+ parts

$4.890

9

$9.650

$6.900

$5.120

$4.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,475 parts In-Stock

1+ parts

$5.412

100+ parts

-

1k+ parts

-

10k+ parts

-

2,475

$5.412

-

-

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Vyrian

USA . 5,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,842

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,597 parts In-Stock

1+ parts

$5.127

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

$5.127

-

-

-

Component Stockers USA

USA . 1,742 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

$7.190

-

-

-

Microchip USA

USA . 2,602 parts In-Stock

1+ parts

$15.580

100+ parts

$15.360

1k+ parts

$15.250

10k+ parts

$15.140

2,602

$15.580

$15.360

$15.250

$15.140

Parana Technologies

USA . 33 parts In-Stock

1+ parts

$51.122

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$51.122

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-

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ChromeModa Solutions

Germany . 3,317 parts In-Stock

1+ parts

$57.440

100+ parts

$47.101

1k+ parts

-

10k+ parts

-

3,317

$57.440

$47.101

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-

IDEA Electronic Components Group

UK . 951 parts In-Stock

1+ parts

$57.440

100+ parts

$54.568

1k+ parts

$51.696

10k+ parts

-

951

$57.440

$54.568

$51.696

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DigiPath Technology Company

USA . 963 parts In-Stock

1+ parts

-

100+ parts

$51.788

1k+ parts

-

10k+ parts

-

963

-

$51.788

-

-

Overview

Unleash the power of innovation with the MSP430F6721AIPN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that redefine possibilities. Ideal for a range of applications, this product offers unmatched value with its advanced features and capabilities. Experience seamless connectivity, low power modes, and high-speed performance to take your projects to the next level. Trust Texas Instruments to deliver excellence with the MSP430F6721AIPN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring long-lasting performance.

Bit Size: 16

16-bit architecture allows for higher precision and more complex calculations, making the microcontroller suitable for a wide range of applications.

No. of Terminals: 80

Having 80 terminals provides flexibility for connecting external devices and peripherals, allowing for enhanced functionality in the overall system.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing speeds and responsiveness, making the microcontroller suitable for tasks that require quick execution.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interact with and process analog sensor inputs effectively.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient and streamlined execution of instructions, making the product power-efficient and suitable for low-power applications.

Technical Specifications

Microcontrollers MSP430F6721AIPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6721AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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