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MSP430F6659IZQWR

Texas Instruments

MSP430F6659IZQWR by Texas Instruments

MSP430F6659IZQWR by Texas Instruments is a 16-bit microcontroller with 524288 ROM words and 64 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 2-Ch 12-Bit DACs, 16-Ch ADCs, and multiple connectivity options (I2C, SPI, UART), it offers versatile solutions in embedded systems design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,832 parts In-Stock

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4,832

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Vyrian

USA . 3,239 parts In-Stock

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3,239

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,460 parts In-Stock

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$7.000

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1,460

$7.000

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AZTECH Wire

Italy . 579 parts In-Stock

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$16.219

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579

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One Stop Electronics

USA . 1,356 parts In-Stock

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$25.000

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$25.000

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Parana Technologies

USA . 2,007 parts In-Stock

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$59.452

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$59.452

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

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$66.800

100+ parts

$63.460

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$60.120

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2,274

$66.800

$63.460

$60.120

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ChromeModa Solutions

Germany . 140 parts In-Stock

1+ parts

$66.800

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$54.776

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140

$66.800

$54.776

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Continental Prestige Electronics

USA . 5,756 parts In-Stock

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5,756

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Argo Parts USA

USA . 3,141 parts In-Stock

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Corphita

USA . 2,283 parts In-Stock

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2,283

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$60.227

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Microchip USA

USA . 336 parts In-Stock

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336

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Unleash the power of innovation with the MSP430F6659IZQWR by Texas Instruments. This cutting-edge microcontroller, part of the renowned MSP430 family, offers unparalleled quality and performance for a wide range of applications. With its advanced features such as DAC channels and DMA channels, this device enables seamless connectivity and efficient data processing. Experience the reliability and precision of Texas Instruments technology, providing customers with exceptional value and benefits. Elevate your projects with the MSP430F6659IZQWR and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Allows for easy automated assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Provides a wide operating range for flexibility in various power supply options.

Package Shape: SQUARE

Enables efficient use of space on circuit boards, maximizing component placement.

Bit Size: 16

Offers a good balance between processing power and cost-effectiveness for many applications.

DAC Channels: YES

Allows for precise analog output control, essential for applications requiring accurate voltage levels.

Power Supplies (V): 2/3.3

Versatile supply voltage options cater to different power requirements in diverse applications.

No. of Terminals: 113

Sufficient terminal connections for interfacing with multiple peripheral devices.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Facilitates high-density mounting, reducing PCB footprint and enhancing overall system integration.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even at lower power supply levels, saving energy.

Maximum Operating Temperature: 85 °C

Suitable for harsh environments with high operating temperature requirements.

CPU Family: MSP430

Known for its low power consumption and efficient processing capabilities, making it an excellent choice for battery-powered applications.

No. of External Interrupts: 8

Sufficient interrupt handling capability for real-time event-driven applications.

Minimum Operating Temperature: -40 °C

Offers reliable operation in extreme cold conditions, expanding the product's usability range.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Enables accurate analog-to-digital conversion for precise data acquisition and processing.

DMA Channels: YES

Enhances data transfer efficiency, reducing CPU workload and improving overall system performance.

Terminal Position: BOTTOM

Convenient terminal placement for ease of PCB layout and assembly.

ROM Words: 524288

Sufficient memory capacity for storing program instructions and data in complex applications.

Maximum Seated Height: 1 mm

Low-profile design for space-constrained applications with height limitations.

Digital To Analog Convertors: 2-Ch 12-Bit

Offers dual-channel high-resolution DACs for versatile analog signal generation.

RAM Words: 64

Provides ample storage for temporary data processing, ensuring efficient multitasking capabilities.

Width: 7 mm

Compact form factor suitable for small-scale designs and space-saving applications.

Boundary Scan: YES

Simplifies debugging and testing processes during product development and maintenance.

Technical Specifications

Microcontrollers MSP430F6659IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6659IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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