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MSP430F6638IZQWT

Texas Instruments

MSP430F6638IZQWT by Texas Instruments

MSP430F6638IZQWT by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 18 timers. Ideal for industrial applications, it features 2 DAC channels, 16 ADC channels, and peripherals like BOR and DMA for efficient system control. Operating at up to 20 MHz with a supply voltage range of 2.4V to 3.6V, this microcontroller offers versatile connectivity options including I2C and UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,045 parts In-Stock

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Digiode

USA . 3,699 parts In-Stock

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3,699

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

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$12.893

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One Stop Electronics

USA . 667 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,192 parts In-Stock

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$59.832

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ChromeModa Solutions

Germany . 5,198 parts In-Stock

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$67.227

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$55.126

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

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$67.227

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$63.866

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$60.504

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2,088

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Corphita

USA . 2,149 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

USA . 193 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the MSP430F6638IZQWT from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted a high-quality microcontroller that boasts unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller offers customers unmatched value and benefits. Whether you're looking to streamline your processes or enhance your products, the MSP430F6638IZQWT delivers cutting-edge technology that will propel your projects to new heights. Experience the difference with Texas Instruments and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, increasing flexibility in design and compatibility with different systems.

Bit Size: 16

High-bit size allows for complex computations and processing capabilities, making the microcontroller suitable for sophisticated applications.

DAC Channels: YES

Digital to analog convertors allow for conversion of digital signals to analog, expanding the range of applications this microcontroller can be used in.

No. of Terminals: 113

Having a large number of terminals allows for more connections and interfaces, enabling the microcontroller to interact with a variety of external components.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for usage in harsh environments.

ADC Channels: YES

Analog to digital convertors enable the microcontroller to interface with analog sensors and signals, broadening its application range.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture enhances the microcontroller's performance and efficiency in processing instructions.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing speed, making the microcontroller suitable for applications requiring real-time data processing.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Multiple connectivity options enable the microcontroller to communicate with a variety of devices and interfaces, enhancing its versatility.

Technical Specifications

Microcontrollers MSP430F6638IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6638IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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