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MSP430F6637IPZ

Texas Instruments

MSP430F6637IPZ by Texas Instruments

MSP430F6637IPZ by Texas Instruments is a 16-bit microcontroller with 196608 ROM words and 16384 RAM bytes. It operates at a max frequency of 20 MHz, suitable for industrial applications requiring up to 18 timers and peripherals like BOR, CRC, and DMA. The package style is flatpack with low profile, fine pitch design.

Median Price

$8.059

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,960 parts In-Stock

1+ parts

$8.059

100+ parts

$6.570

1k+ parts

$4.380

10k+ parts

-

3,960

$8.059

$6.570

$4.380

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,215 parts In-Stock

1+ parts

$7.656

100+ parts

-

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-

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2,215

$7.656

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Vyrian

USA . 4,738 parts In-Stock

1+ parts

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4,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 176 parts In-Stock

1+ parts

$7.253

100+ parts

-

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176

$7.253

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AZTECH Wire

Italy . 662 parts In-Stock

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$11.420

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662

$11.420

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Microchip USA

USA . 1,691 parts In-Stock

1+ parts

$22.050

100+ parts

$21.730

1k+ parts

$21.580

10k+ parts

$21.420

1,691

$22.050

$21.730

$21.580

$21.420

Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

$48.519

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1,226

$48.519

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ChromeModa Solutions

Germany . 1,490 parts In-Stock

1+ parts

$54.516

100+ parts

$44.703

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1,490

$54.516

$44.703

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$54.516

100+ parts

$51.790

1k+ parts

$49.064

10k+ parts

-

709

$54.516

$51.790

$49.064

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Component Stockers USA

USA . 2,537 parts In-Stock

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2,537

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DigiPath Technology Company

USA . 2,311 parts In-Stock

1+ parts

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100+ parts

$49.152

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2,311

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$49.152

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6637IPZ microcontroller. Designed with precision and reliability in mind, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, the possibilities are endless with this high-quality product. Experience seamless connectivity, efficient performance, and unmatched value that only Texas Instruments can provide. Upgrade your projects today and discover the advantages of the MSP430F6637IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the microcontroller.

Maximum Supply Voltage: 3.6 V

Provides a wide range of supply voltage, allowing for flexibility in power sourcing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and execution of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Connectivity: "I2C, IRDA, SCI(2), SPI(2), UART

Multiple connectivity options enable versatile communication with external devices and systems.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to interface with analog sensors and inputs, expanding its range of applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speed and efficiency, improving overall system performance.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for quick execution of instructions and operations, leading to faster processing speeds.

No. of I/O Lines: 74

Abundance of input/output lines provides ample connectivity options and flexibility for interfacing with external components.

Technical Specifications

Microcontrollers MSP430F6637IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6637IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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