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MSP430F6636IZQWT

Texas Instruments

MSP430F6636IZQWT by Texas Instruments

MSP430F6636IZQWT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 18432 RAM bytes, and 16-Ch 12-Bit ADC. It operates at up to 32 MHz, suitable for industrial applications requiring BOR, LCD, RTC, and USB connectivity in a compact package with a max seated height of 1 mm.

Median Price

$6.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,250 parts In-Stock

1+ parts

$6.300

100+ parts

$6.170

1k+ parts

$6.050

10k+ parts

-

1,250

$6.300

$6.170

$6.050

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,048 parts In-Stock

1+ parts

-

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-

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3,048

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Digiode

USA . 461 parts In-Stock

1+ parts

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461

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Cyclops Electronics Ltd

UK . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 854 parts In-Stock

1+ parts

$4.000

100+ parts

-

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854

$4.000

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$7.538

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861

$7.538

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Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

$35.470

100+ parts

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2,220

$35.470

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DigiPath Technology Company

USA . 599 parts In-Stock

1+ parts

$39.057

100+ parts

$35.932

1k+ parts

-

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599

$39.057

$35.932

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ChromeModa Solutions

Germany . 2,043 parts In-Stock

1+ parts

$39.854

100+ parts

$32.680

1k+ parts

-

10k+ parts

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2,043

$39.854

$32.680

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IDEA Electronic Components Group

UK . 847 parts In-Stock

1+ parts

$39.854

100+ parts

$37.861

1k+ parts

$35.869

10k+ parts

-

847

$39.854

$37.861

$35.869

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,586 parts In-Stock

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1,586

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Microchip USA

USA . 247 parts In-Stock

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247

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Overview

Experience the innovation and reliability of Texas Instruments with the MSP430F6636IZQWT microcontroller. This powerful device offers a wide range of applications in various industries, providing exceptional performance and efficiency. With advanced features like DAC channels, ADC channels, and DMA channels, this microcontroller delivers unmatched versatility and functionality. Trust Texas Instruments for quality products that bring value to your projects and elevate your designs to the next level. Upgrade to the MSP430F6636IZQWT today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the microcontroller, making it suitable for extended use in various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power supply options and can support a wide range of applications.

Bit Size: 16

The 16-bit size allows for more complex data processing and calculations, making the microcontroller suitable for applications that require higher processing capabilities.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals to analog signals accurately, making it ideal for applications that require precise control over analog outputs.

ADC Channels: YES

Having ADC channels allows the microcontroller to accurately convert analog signals to digital signals, making it suitable for applications that require input signal processing.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller allows for efficient and speedy execution of instructions, making it a good choice for applications requiring high performance.

Technical Specifications

Microcontrollers MSP430F6636IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6636IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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