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MSP430F6636IZQWR

Texas Instruments

MSP430F6636IZQWR by Texas Instruments

MSP430F6636IZQWR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 18 timers, 2 DAC channels, and 16 ADC channels suitable for industrial applications requiring high-speed processing up to 20 MHz. With connectivity options like I2C, IRDA, SCI(2), SPI(2), UART, it offers versatile interfacing capabilities.

Median Price

$10.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,923 parts In-Stock

1+ parts

$10.010

100+ parts

$7.486

1k+ parts

$5.677

10k+ parts

-

1,923

$10.010

$7.486

$5.677

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,429 parts In-Stock

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-

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8,429

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Digiode

USA . 3,025 parts In-Stock

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3,025

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Distributors (Availability)

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One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$3.000

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-

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1,556

$3.000

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AZTECH Wire

Italy . 412 parts In-Stock

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$9.012

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412

$9.012

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Parana Technologies

USA . 17 parts In-Stock

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$53.436

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17

$53.436

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DigiPath Technology Company

USA . 253 parts In-Stock

1+ parts

$58.840

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253

$58.840

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ChromeModa Solutions

Germany . 5,177 parts In-Stock

1+ parts

$60.041

100+ parts

$49.234

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5,177

$60.041

$49.234

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IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$60.041

100+ parts

$57.039

1k+ parts

$54.037

10k+ parts

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779

$60.041

$57.039

$54.037

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Corphita

USA . 1,089 parts In-Stock

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Microchip USA

USA . 194 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments MSP430F6636IZQWR microcontroller, offering unparalleled performance and reliability in a compact package. With a trusted manufacturer like Texas Instruments behind it, this microcontroller delivers exceptional quality, making it ideal for a wide range of applications. From industrial automation to consumer electronics, the MSP430F6636IZQWR provides value-added features like multiple ADC channels, DAC channels, and DMA channels, ensuring seamless integration into your projects. Experience the benefits of cutting-edge technology combined with user-friendly design - choose the MSP430F6636IZQWR for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and ensures long-term reliability of the product.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Suitable for handling complex computational tasks efficiently.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors or devices.

ROM Words: 131072

Sufficient memory space for storing program instructions and data.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing and response times.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and lower power consumption.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Multiple communication interfaces provide versatility in connecting to external devices.

Technical Specifications

Microcontrollers MSP430F6636IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6636IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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