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MSP430F6635IPZ

Texas Instruments

MSP430F6635IPZ by Texas Instruments

MSP430F6635IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 18 timers. It features 16-Ch 12-Bit ADCs, PWM channels, and connectivity options like I2C, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,187 parts In-Stock

1+ parts

$8.690

100+ parts

$7.085

1k+ parts

$4.723

10k+ parts

-

10,187

$8.690

$7.085

$4.723

-

DigiKey

USA . 75 parts In-Stock

1+ parts

$12.080

100+ parts

$8.168

1k+ parts

$7.411

10k+ parts

-

75

$12.080

$8.168

$7.411

-

Mouser Electronics

USA . 45 parts In-Stock

1+ parts

$12.080

100+ parts

$8.160

1k+ parts

$7.400

10k+ parts

-

45

$12.080

$8.160

$7.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,444 parts In-Stock

1+ parts

$8.256

100+ parts

-

1k+ parts

-

10k+ parts

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1,444

$8.256

-

-

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Vyrian

USA . 3,992 parts In-Stock

1+ parts

-

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-

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3,992

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

-

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550

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Bristol Electronics

USA . 220 parts In-Stock

1+ parts

-

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220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,456 parts In-Stock

1+ parts

$7.390

100+ parts

$7.205

1k+ parts

$7.168

10k+ parts

-

3,456

$7.390

$7.205

$7.168

-

Ampacity Inc.

Singapore . 3,336 parts In-Stock

1+ parts

$7.390

100+ parts

-

1k+ parts

-

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3,336

$7.390

-

-

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Corohmni

South Africa . 428 parts In-Stock

1+ parts

$7.550

100+ parts

-

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428

$7.550

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Corphita

USA . 3,703 parts In-Stock

1+ parts

$7.821

100+ parts

-

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-

10k+ parts

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3,703

$7.821

-

-

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$8.758

100+ parts

$8.057

1k+ parts

$7.550

10k+ parts

-

70

$8.758

$8.057

$7.550

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Microchip USA

USA . 4,695 parts In-Stock

1+ parts

$33.040

100+ parts

-

1k+ parts

-

10k+ parts

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4,695

$33.040

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Parana Technologies

USA . 1,315 parts In-Stock

1+ parts

$44.664

100+ parts

$4,147.708

1k+ parts

$40.197

10k+ parts

-

1,315

$44.664

$4,147.708

$40.197

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$49.180

100+ parts

-

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1,179

$49.180

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$50.184

100+ parts

$47.675

1k+ parts

$45.166

10k+ parts

-

1,978

$50.184

$47.675

$45.166

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ChromeModa Solutions

Germany . 1,868 parts In-Stock

1+ parts

$50.184

100+ parts

$41.151

1k+ parts

-

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1,868

$50.184

$41.151

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Argo Parts USA

USA . 3,433 parts In-Stock

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3,433

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 251 parts In-Stock

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251

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Continental Prestige Electronics

USA . 244 parts In-Stock

1+ parts

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244

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6635IPZ microcontroller. Experience unparalleled quality and reliability from a trusted manufacturer in the industry. This versatile device is perfect for a wide range of applications, offering exceptional value and benefits to customers. From its robust design to advanced features, this microcontroller provides the performance and efficiency you need for your projects. Embrace innovation and take your creations to new heights with the MSP430F6635IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable and long-lasting electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and resources during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for various applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 enhances the processing speed and efficiency of the microcontroller, ensuring smooth operation.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design, making it suitable for smaller electronic devices with limited space.

Bit Size: 16

The 16-bit size allows for efficient data processing and handling of larger data sets, making it suitable for complex applications that require high computational power.

Power Supplies (V): 2/3.3

The availability of multiple power supply options (2V and 3.3V) gives flexibility in designing and powering the microcontroller, ensuring compatibility with different systems.

No. of Terminals: 100

With a higher number of terminals, there is greater connectivity and expansion options, allowing for integration with a wide range of peripherals and devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style promotes a sleek and efficient design, ideal for applications where space-saving is crucial.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with a wide range of power sources, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430F6635IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6635IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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