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MSP430F6632IPZ

Texas Instruments

MSP430F6632IPZ by Texas Instruments

MSP430F6632IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 20 MHz, suitable for industrial applications requiring up to 18 timers and various peripherals like UART, SPI, and I2C connectivity.

Median Price

$7.295

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,708 parts In-Stock

1+ parts

$8.690

100+ parts

$7.085

1k+ parts

$4.723

10k+ parts

-

1,708

$8.690

$7.085

$4.723

-

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$5.900

1k+ parts

$5.280

10k+ parts

$4.970

30

-

$5.900

$5.280

$4.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,222 parts In-Stock

1+ parts

$6.232

100+ parts

-

1k+ parts

-

10k+ parts

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3,222

$6.232

-

-

-

Bristol Electronics

USA . 45 parts In-Stock

1+ parts

$8.244

100+ parts

$5.152

1k+ parts

-

10k+ parts

-

45

$8.244

$5.152

-

-

Vyrian

USA . 3,649 parts In-Stock

1+ parts

-

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-

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3,649

-

-

-

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ACDS - Activité Composants Distribution Service

France . 45 parts In-Stock

1+ parts

-

100+ parts

-

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45

-

-

-

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Dan-Mar Components

USA . 45 parts In-Stock

1+ parts

-

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-

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45

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,299 parts In-Stock

1+ parts

$5.904

100+ parts

-

1k+ parts

-

10k+ parts

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2,299

$5.904

-

-

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AZTECH Wire

Italy . 1,016 parts In-Stock

1+ parts

$11.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$11.300

-

-

-

Parana Technologies

USA . 488 parts In-Stock

1+ parts

$15.777

100+ parts

$1,465.137

1k+ parts

$14.199

10k+ parts

-

488

$15.777

$1,465.137

$14.199

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DigiPath Technology Company

USA . 2,104 parts In-Stock

1+ parts

$17.372

100+ parts

-

1k+ parts

-

10k+ parts

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2,104

$17.372

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-

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ChromeModa Solutions

Germany . 6,992 parts In-Stock

1+ parts

$17.727

100+ parts

$14.536

1k+ parts

-

10k+ parts

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6,992

$17.727

$14.536

-

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IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$17.727

100+ parts

$16.841

1k+ parts

$15.954

10k+ parts

-

1,986

$17.727

$16.841

$15.954

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Microchip USA

USA . 2,670 parts In-Stock

1+ parts

$23.770

100+ parts

$23.440

1k+ parts

$23.270

10k+ parts

$23.100

2,670

$23.770

$23.440

$23.270

$23.100

Perfect Parts

USA . 245 parts In-Stock

1+ parts

-

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245

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F6632IPZ microcontroller. Built with precision and expertise, this versatile device is perfect for a wide range of applications. From smart home devices to industrial automation, the MSP430F6632IPZ offers unparalleled value and performance. With advanced features such as DMA channels and ADC capabilities, this microcontroller provides seamless connectivity and reliable operation. Take your projects to the next level with the MSP430F6632IPZ and experience the quality and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, providing good protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, making the microcontroller versatile in different power supply setups.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures, ideal for applications in harsh environments or outdoor settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities, making it suitable for real-time applications.

Connectivity: 'I2C, IRDA, SCI(2), SPI(2), UART'

Multiple communication interfaces allow for seamless integration with other devices, enhancing its connectivity options.

No. of DMA Channels: 6

Direct Memory Access channels improve data transfer efficiency, enabling faster and smoother operation.

Technical Specifications

Microcontrollers MSP430F6632IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F6632IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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