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MSP430F6631IPZ

Texas Instruments

MSP430F6631IPZ by Texas Instruments

MSP430F6631IPZ by Texas Instruments is a 16-bit microcontroller with 196608 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 20 MHz, making it suitable for industrial applications requiring high-speed processing. With features like BOR, CRC, and DMA channels, it offers versatile connectivity options including I2C, SPI, and UART interfaces.

Median Price

$8.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,276 parts In-Stock

1+ parts

$8.700

100+ parts

$7.092

1k+ parts

$4.728

10k+ parts

-

3,276

$8.700

$7.092

$4.728

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,331 parts In-Stock

1+ parts

$8.265

100+ parts

-

1k+ parts

-

10k+ parts

-

2,331

$8.265

-

-

-

Vyrian

USA . 8,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,345

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,364 parts In-Stock

1+ parts

$7.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

$7.830

-

-

-

AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$10.460

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$10.460

-

-

-

Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$23.800

100+ parts

$23.460

1k+ parts

$23.290

10k+ parts

$23.120

2,892

$23.800

$23.460

$23.290

$23.120

Parana Technologies

USA . 1,818 parts In-Stock

1+ parts

$34.993

100+ parts

-

1k+ parts

-

10k+ parts

-

1,818

$34.993

-

-

-

DigiPath Technology Company

USA . 1,152 parts In-Stock

1+ parts

$38.532

100+ parts

$35.449

1k+ parts

-

10k+ parts

-

1,152

$38.532

$35.449

-

-

ChromeModa Solutions

Germany . 3,357 parts In-Stock

1+ parts

$39.318

100+ parts

$32.241

1k+ parts

-

10k+ parts

-

3,357

$39.318

$32.241

-

-

IDEA Electronic Components Group

UK . 1,021 parts In-Stock

1+ parts

$39.318

100+ parts

$37.352

1k+ parts

$35.386

10k+ parts

-

1,021

$39.318

$37.352

$35.386

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F6631IPZ microcontroller. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this microcontroller delivers seamless connectivity and efficient processing capabilities. Elevate your projects with the MSP430F6631IPZ and experience the ultimate in quality and value that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage requirements.

Bit Size: 16

Offers a good balance between performance and power consumption for the microcontroller.

ROM Words: 196608

Ample storage capacity for program code and data, allowing for the implementation of complex algorithms and applications.

No. of Timers: 18

Versatility in timing functions and multitasking capabilities for precise control and coordination of tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and optimized performance for various applications.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Versatile connectivity options for interfacing with a wide range of external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F6631IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F6631IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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