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MSP430F6630IPZR

Texas Instruments

MSP430F6630IPZR by Texas Instruments

MSP430F6630IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 74 I/O lines. It operates at a max clock frequency of 32 MHz and is suitable for industrial applications requiring a CPU family of MSP430 with DMA channels and PWM support.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,063 parts In-Stock

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Digiode

USA . 3,639 parts In-Stock

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AZTECH Wire

Italy . 64 parts In-Stock

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$16.889

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One Stop Electronics

USA . 1,634 parts In-Stock

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$28.000

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Parana Technologies

USA . 81 parts In-Stock

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$29.423

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$2,732.326

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$26.480

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DigiPath Technology Company

USA . 1,739 parts In-Stock

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$32.398

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ChromeModa Solutions

Germany . 2,939 parts In-Stock

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$33.059

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$27.108

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IDEA Electronic Components Group

UK . 618 parts In-Stock

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$33.059

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$31.406

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$29.753

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Component Stockers USA

USA . 747 parts In-Stock

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$99.990

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Corphita

USA . 2,491 parts In-Stock

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Futuretech Components

Singapore . 828 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6630IPZR microcontroller. Crafted with precision and expertise, this device offers unmatched quality and reliability in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller delivers exceptional performance and efficiency. Experience the seamless integration, high-speed processing, and advanced features that set this product apart. Elevate your projects to new heights with the Texas Instruments MSP430F6630IPZR - the ultimate choice for discerning customers seeking top-tier technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a variety of applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power source selection and compatibility with a wide range of electronic components.

Bit Size: 16

The 16-bit architecture allows for faster and more efficient processing of data compared to lower-bit microcontrollers, making it suitable for complex tasks.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for battery-powered applications.

Flash ROM Programmability

The ability to reprogram the ROM with new firmware or software updates makes the microcontroller versatile and future-proof.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for speedy execution of instructions, making the microcontroller efficient for time-critical applications.

RAM Bytes: 16384

With a large RAM size, the microcontroller can store and access more data simultaneously, enhancing its processing capabilities.

No. of I/O Lines: 74

The high number of input/output lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers MSP430F6630IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6630IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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