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MSP430F6459IZQWR

Texas Instruments

MSP430F6459IZQWR by Texas Instruments

MSP430F6459IZQWR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, featuring 16-Ch 12-Bit ADC and 2-Ch 12-Bit DAC channels. Ideal for industrial applications, it offers a max clock frequency of 32MHz, connectivity options like I2C(3), SPI(6), and UART(3), and peripherals including BOR, LCD, and RTC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,724 parts In-Stock

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Digiode

USA . 962 parts In-Stock

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962

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Distributors (Availability)

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One Stop Electronics

USA . 599 parts In-Stock

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$9.000

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599

$9.000

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AZTECH Wire

Italy . 556 parts In-Stock

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$16.538

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Parana Technologies

USA . 1,561 parts In-Stock

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$70.719

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$70.719

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DigiPath Technology Company

USA . 2,358 parts In-Stock

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$77.871

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$71.641

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2,358

$77.871

$71.641

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IDEA Electronic Components Group

UK . 573 parts In-Stock

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$79.460

100+ parts

$75.487

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$71.514

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573

$79.460

$75.487

$71.514

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ChromeModa Solutions

Germany . 278 parts In-Stock

1+ parts

$79.460

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$65.157

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278

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$65.157

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Corphita

USA . 3,599 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430F6459IZQWR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC and ADC channels, DMA capabilities, and multiple peripherals. With its compact design and low power consumption, the MSP430F6459IZQWR offers customers exceptional value and performance. Revolutionize your projects with the cutting-edge technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microcontroller lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can be used in a variety of applications without the risk of damage due to voltage spikes.

Bit Size: 16

The 16-bit size allows for higher precision in calculations and data processing, making this microcontroller suitable for tasks requiring complex operations.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals into analog output signals, expanding its capability to interface with analog components.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, making it versatile for sensor interfacing and data acquisition applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low-power consumption and high performance, making this microcontroller energy-efficient and suitable for battery-operated devices.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32 MHz allows for fast data processing and response times, making this microcontroller suitable for real-time applications.

RAM Bytes: 67584

With a large RAM size of 67584 bytes, this microcontroller can handle extensive data processing and storage requirements, making it suitable for multitasking applications.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

Multiple connectivity options such as I2C, IRDA, SPI, and UART provide flexibility for interfacing with a wide range of external devices, making this microcontroller versatile for diverse applications.

Technical Specifications

Microcontrollers MSP430F6459IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

67584

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6459IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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