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MSP430F6458IPZR

Texas Instruments

MSP430F6458IPZR by Texas Instruments

MSP430F6458IPZR by Texas Instruments is a 16-bit microcontroller with 393216 ROM words, 34816 RAM bytes, and 16-Ch 12-Bit ADC. It operates at a max clock frequency of 32 MHz and has peripherals like BOR, LCD, PWM. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,775 parts In-Stock

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Digiode

USA . 4,607 parts In-Stock

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4,607

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Distributors (Availability)

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AZTECH Wire

Italy . 793 parts In-Stock

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$12.569

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One Stop Electronics

USA . 546 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,916 parts In-Stock

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$77.094

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DigiPath Technology Company

USA . 342 parts In-Stock

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$84.891

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342

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ChromeModa Solutions

Germany . 4,880 parts In-Stock

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$86.623

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$71.031

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$86.623

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

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$86.623

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$82.292

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$77.961

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1,273

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$77.961

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Component Stockers USA

USA . 410 parts In-Stock

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$99.990

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Corphita

USA . 3,359 parts In-Stock

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Microchip USA

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Overview

Unlock unparalleled performance and efficiency with the Texas Instruments MSP430F6458IPZR Microcontroller. Designed with cutting-edge technology and precision engineering, this device is a game-changer in the world of microcontrollers. Ideal for a wide range of applications, from consumer electronics to industrial automation, the MSP430F6458IPZR offers unmatched value and benefits to customers. With features like DAC channels, ADC channels, DMA channels, and peripherals like BOR, LCD, and RTC, this microcontroller is a versatile solution for your project needs. Trust Texas Instruments for top-quality products that deliver superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making it a good choice for mass production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources, providing flexibility in design.

Bit Size: 16

The 16-bit architecture allows for higher precision and more complex operations, making this microcontroller suitable for applications that require advanced computation.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast processing speeds and responsiveness, making this microcontroller suitable for applications that require real-time data processing.

RAM Bytes: 34816

With a large RAM capacity, this microcontroller can handle complex data storage and manipulation tasks efficiently.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

Multiple connectivity options allow for versatile communication with other devices or peripherals, enhancing the functionality and flexibility of the product.

Technical Specifications

Microcontrollers MSP430F6458IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6458IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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