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MSP430F6438IPZ

Texas Instruments

MSP430F6438IPZ by Texas Instruments

MSP430F6438IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 18 RAM words. It features 2 DAC channels, 16 ADC channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$8.436

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,294 parts In-Stock

1+ parts

$9.778

100+ parts

$7.971

1k+ parts

$5.314

10k+ parts

-

1,294

$9.778

$7.971

$5.314

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Arrow

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$7.093

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-

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180

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$7.093

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,346 parts In-Stock

1+ parts

$9.289

100+ parts

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2,346

$9.289

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Vyrian

USA . 4,400 parts In-Stock

1+ parts

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4,400

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-

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LWI Electronics Inc

India . 2 parts In-Stock

1+ parts

-

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2

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,613 parts In-Stock

1+ parts

$8.800

100+ parts

-

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-

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3,613

$8.800

-

-

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AZTECH Wire

Italy . 44 parts In-Stock

1+ parts

$20.810

100+ parts

-

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44

$20.810

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Microchip USA

USA . 1,349 parts In-Stock

1+ parts

$31.560

100+ parts

$31.110

1k+ parts

$30.880

10k+ parts

$30.650

1,349

$31.560

$31.110

$30.880

$30.650

Parana Technologies

USA . 1,299 parts In-Stock

1+ parts

$61.808

100+ parts

-

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1,299

$61.808

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DigiPath Technology Company

USA . 2,321 parts In-Stock

1+ parts

$68.058

100+ parts

$62.613

1k+ parts

-

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2,321

$68.058

$62.613

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ChromeModa Solutions

Germany . 2,253 parts In-Stock

1+ parts

$69.447

100+ parts

$56.947

1k+ parts

-

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2,253

$69.447

$56.947

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IDEA Electronic Components Group

UK . 196 parts In-Stock

1+ parts

$69.447

100+ parts

$65.975

1k+ parts

$62.502

10k+ parts

-

196

$69.447

$65.975

$62.502

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QUARKTWIN TECHNOLOGY LTD

USA . 21,948 parts In-Stock

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21,948

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Lixinc

USA . 4,738 parts In-Stock

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4,738

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Perfect Parts

USA . 302 parts In-Stock

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302

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6438IPZ Microcontroller. Crafted with precision and expertise, this innovative device offers unparalleled performance and reliability for a wide range of applications. From smart devices to industrial automation, this microcontroller is designed to deliver cutting-edge solutions that exceed expectations. Experience seamless connectivity, efficient power management, and advanced features that elevate your projects to new heights. Trust Texas Instruments for quality, value, and unbeatable advantages in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microcontroller by reducing memory access times and increasing overall efficiency.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with various power sources.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting, making it suitable for automated assembly processes.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and devices, expanding its capabilities in data acquisition applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient execution of instructions, leading to faster processing speeds and improved overall performance.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the program memory, making it convenient for development and debugging processes.

Technical Specifications

Microcontrollers MSP430F6438IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6438IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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