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MSP430F6436IZQWR

Texas Instruments

MSP430F6436IZQWR by Texas Instruments

MSP430F6436IZQWR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 18432 RAM bytes, and 74 I/O lines. It operates at a max clock frequency of 32 MHz and has DAC, ADC, DMA channels for industrial applications requiring precise control and data processing within the temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,453 parts In-Stock

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4,453

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Vyrian

USA . 3,837 parts In-Stock

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3,837

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 739 parts In-Stock

1+ parts

$16.000

100+ parts

-

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739

$16.000

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AZTECH Wire

Italy . 245 parts In-Stock

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$18.050

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245

$18.050

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Parana Technologies

USA . 1,657 parts In-Stock

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$28.514

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$48.385

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1,657

$28.514

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$48.385

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DigiPath Technology Company

USA . 1,177 parts In-Stock

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$31.397

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1,177

$31.397

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IDEA Electronic Components Group

UK . 622 parts In-Stock

1+ parts

$32.038

100+ parts

$30.436

1k+ parts

$28.834

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622

$32.038

$30.436

$28.834

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ChromeModa Solutions

Germany . 193 parts In-Stock

1+ parts

$32.038

100+ parts

$26.271

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193

$32.038

$26.271

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Microchip USA

USA . 362 parts In-Stock

1+ parts

$32.290

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$32.100

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$32.000

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$31.900

362

$32.290

$32.100

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$31.900

Component Stockers USA

USA . 465 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 1,093 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6436IZQWR microcontroller. Manufactured by a trusted industry leader, this innovative device offers unparalleled performance and reliability. With a variety of applications in mind, this microcontroller is designed to meet your unique needs. Experience the value of cutting-edge technology, seamless integration, and unmatched efficiency. Elevate your projects with the Texas Instruments MSP430F6436IZQWR and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a variety of power sources, offering flexibility in design.

Package Shape: SQUARE

Square package shape provides uniformity in design and easier integration into PCB layouts.

Bit Size: 16

16-bit architecture offers improved computational capabilities and precision for applications demanding higher performance.

DAC Channels: YES

Presence of DAC channels enables accurate and efficient analog output, essential for many control and signal processing applications.

Power Supplies (V): 2/3.3

Multiple power supply options allow for compatibility with different power sources, making the microcontroller versatile.

No. of Terminals: 113

Higher number of terminals provide more connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Inclusion of grid array, thin profile, and fine pitch package style enables a compact and space-efficient design, suitable for applications with size constraints.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for operation in low-power scenarios, conserving energy and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates proven reliability, efficiency, and a wide range of available resources and support for development.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures functionality in extreme cold environments, suitable for industrial and outdoor applications.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

ADC Channels: YES

Integrated ADC channels enable accurate analog-to-digital conversion, essential for input signal processing and sensor interfacing.

DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving system efficiency and enabling faster data processing.

Terminal Position: BOTTOM

Bottom terminal position eases PCB layout and routing, allowing for more compact and efficient designs.

ROM Words: 131072

Large ROM capacity provides ample space for program storage, accommodating complex algorithms and applications.

Maximum Seated Height: 1 mm

Low seated height contributes to a slim and compact overall profile, ideal for applications with space constraints.

Width: 7 mm

Narrow width facilitates PCB layout and integration into space-limited designs, optimizing the use of available space.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency supports fast processing speeds, making the microcontroller suitable for real-time and high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for 30 seconds ensures reliable solder connections during PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance makes the microcontroller suitable for lead-free soldering processes, meeting environmental regulations.

Length: 7 mm

Compact length simplifies PCB layout and positioning, contributing to space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliable operation in challenging industrial environments, ensuring long-term performance and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency and speed, making the microcontroller suitable for high-demand applications.

RAM Bytes: 18432

Generous RAM capacity allows for smooth data handling, multitasking, and efficient program execution, supporting complex applications.

Technology: CMOS

CMOS technology offers low power consumption, high integration density, and reliable operation, making the microcontroller energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form simplifies soldering and PCB assembly, ensuring secure and reliable connections for robust performance.

Maximum Supply Current: 6.6 mA

Low maximum supply current consumption minimizes power usage, extending battery life and enabling energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent and reliable operation across different power sources and conditions.

PWM Channels: YES

Presence of PWM channels enables precise control of analog signals, facilitating applications such as motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient reprogramming of the microcontroller, simplifying development and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch offers high-density pinout, enabling more I/O connections and functionality in a compact package.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance during storage and handling, ensuring the integrity and reliability of the microcontroller.

Speed: 20 rpm

The specified speed value may not be relevant to a microcontroller. It is recommended to verify its use case in the context of other specs and requirements.

No. of I/O Lines: 74

Abundant I/O lines provide ample connectivity for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility and applicability.

Technical Specifications

Microcontrollers MSP430F6436IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F6436IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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