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MSP430F5659IZQWR

Texas Instruments

MSP430F5659IZQWR by Texas Instruments

MSP430F5659IZQWR by Texas Instruments is a 16-bit microcontroller with 524288 ROM words and 64 RAM words. It features 2-Ch 12-Bit DAC channels, 16-Ch 12-Bit ADC channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-performance peripherals like BOR, PWM, and UART connectivity.

Median Price

$7.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

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$7.580

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Chip Stock

USA . 3,200 parts In-Stock

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Vyrian

USA . 2,570 parts In-Stock

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Digiode

USA . 524 parts In-Stock

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SPM Sales

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,600 parts In-Stock

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$7.580

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$7.428

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$7.580

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$7.428

One Stop Electronics

USA . 757 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 687 parts In-Stock

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$15.735

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687

$15.735

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Semicontronic

India . 563 parts In-Stock

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$16.000

100+ parts

$15.600

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$15.520

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563

$16.000

$15.600

$15.520

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Parana Technologies

USA . 1,209 parts In-Stock

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$16.007

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$16.351

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$16.007

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DigiPath Technology Company

USA . 2,173 parts In-Stock

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$17.625

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ChromeModa Solutions

Germany . 4,781 parts In-Stock

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$17.985

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$14.748

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IDEA Electronic Components Group

UK . 1,571 parts In-Stock

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$17.985

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$17.086

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$16.186

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1,571

$17.985

$17.086

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$19.463

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$18.490

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$18.490

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52

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$18.490

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Ampacity Inc.

Singapore . 464 parts In-Stock

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$29.000

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Corohmni

South Africa . 242 parts In-Stock

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$54.918

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Perfect Parts

USA . 8,400 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 620 parts In-Stock

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620

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$0.063

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$0.063

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$0.063

500

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$0.063

$0.063

$0.063

Microchip USA

USA . 231 parts In-Stock

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Argo Parts USA

USA . 166 parts In-Stock

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Bastille Electronics

Australia . 97 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5659IZQWR microcontroller, a cutting-edge solution that combines top-notch quality with unmatched performance. As a leader in the industry, Texas Instruments brings you a product that pushes boundaries and redefines possibilities. With applications ranging from consumer electronics to industrial automation, this microcontroller delivers superior value, efficiency, and reliability. Upgrade your projects today and experience the seamless integration, advanced features, and unparalleled benefits that the MSP430F5659IZQWR has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this microcontroller lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

This microcontroller's surface mount feature allows for easy and efficient installation on PCBs, saving valuable space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs, making it versatile and adaptable to different voltage requirements.

Package Shape: SQUARE

The square package shape of this microcontroller allows for uniform and efficient placement on a PCB, optimizing space utilization and ensuring a neat and organized layout.

Bit Size: 16

The 16-bit size of this microcontroller enables it to process data and instructions with higher precision and accuracy, making it suitable for applications that require complex computations.

DAC Channels: YES

The presence of DAC channels in this microcontroller allows for precise control and generation of analog signals, making it well-suited for applications requiring accurate analog outputs.

Power Supplies (V): 2/3.3

This microcontroller's dual power supply compatibility of 2/3.3 V offers flexibility in power options, catering to a wide range of voltage requirements in various applications.

No. of Terminals: 113

With a high number of terminals, this microcontroller provides ample connectivity options for interfacing with external devices, making it versatile and adaptable to diverse system configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch ensures efficient heat dissipation and optimal signal transmission, enhancing the overall performance and reliability of the microcontroller.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage of 2.4 V allows this microcontroller to operate effectively in low-power or battery-powered applications, making it energy-efficient and cost-effective.

Technical Specifications

Microcontrollers MSP430F5659IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5659IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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