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MSP430F5658IZQWT

Texas Instruments

MSP430F5658IZQWT by Texas Instruments

MSP430F5658IZQWT by Texas Instruments is a 16-bit microcontroller with 32KB RAM, 393216 ROM words, and 2-Ch 12-Bit DAC channels. Ideal for industrial applications due to its low power mode, it offers various peripherals like BOR, PWM, and RTC along with connectivity options such as I2C and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,240 parts In-Stock

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Digiode

USA . 131 parts In-Stock

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131

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Distributors (Availability)

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AZTECH Wire

Italy . 232 parts In-Stock

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$18.454

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One Stop Electronics

USA . 635 parts In-Stock

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$29.000

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635

$29.000

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Parana Technologies

USA . 306 parts In-Stock

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$76.156

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DigiPath Technology Company

USA . 649 parts In-Stock

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$83.857

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$77.148

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649

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$77.148

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ChromeModa Solutions

Germany . 562 parts In-Stock

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$85.568

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$70.166

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562

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IDEA Electronic Components Group

UK . 488 parts In-Stock

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$85.568

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$81.290

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$77.011

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488

$85.568

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$77.011

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Component Stockers USA

USA . 238 parts In-Stock

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$99.990

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Corphita

USA . 3,273 parts In-Stock

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Microchip USA

USA . 469 parts In-Stock

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Overview

Experience the power of innovation with the MSP430F5658IZQWT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability in the field of microcontrollers. With a wide range of applications, this product offers unmatched value and benefits to customers seeking advanced solutions for their projects. Embrace cutting-edge technology and unleash your creativity with the MSP430F5658IZQWT, setting new standards in performance and efficiency. Trust Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers as it provides good insulation and protection for the components inside.

Maximum Supply Voltage: 3.6 V

Allows for a wider range of input voltages, making the microcontroller versatile in different power supply scenarios.

ADC Channels: YES

With Analog to Digital Convertors, the microcontroller can interface with analog sensors or signals, expanding its functionality.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

ROM Words: 393216

With a large ROM capacity, the microcontroller can store more program code or data, allowing for complex algorithms to be executed.

Maximum Clock Frequency: 32 MHz

A high clock frequency allows for faster processing speeds, making the microcontroller suitable for time-sensitive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture typically results in efficient and fast operation, enhancing the overall performance of the microcontroller.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3), USB

The multiple connectivity options enable the microcontroller to communicate with a wide range of devices and systems, improving its versatility.

RAM Bytes: 32768

Having a sizable RAM allows the microcontroller to store and manipulate data efficiently, enhancing its overall processing capabilities.

Technical Specifications

Microcontrollers MSP430F5658IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5658IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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