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MSP430F5637IZQWR

Texas Instruments

MSP430F5637IZQWR by Texas Instruments

MSP430F5637IZQWR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 113 terminals, and 32MHz clock frequency. Ideal for industrial applications, it features 16-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like BOR, LCD, and RTC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,027 parts In-Stock

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Digiode

USA . 3,876 parts In-Stock

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3,876

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Distributors (Availability)

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One Stop Electronics

USA . 802 parts In-Stock

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$5.000

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802

$5.000

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AZTECH Wire

Italy . 359 parts In-Stock

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$8.512

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359

$8.512

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Parana Technologies

USA . 1,028 parts In-Stock

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$58.329

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$58.329

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DigiPath Technology Company

USA . 1,423 parts In-Stock

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$64.227

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$59.089

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1,423

$64.227

$59.089

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ChromeModa Solutions

Germany . 908 parts In-Stock

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$65.538

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$53.741

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908

$65.538

$53.741

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IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$65.538

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$62.261

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$58.984

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411

$65.538

$62.261

$58.984

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Component Stockers USA

USA . 564 parts In-Stock

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$99.990

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Corphita

USA . 982 parts In-Stock

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Microchip USA

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Overview

Unlock the full potential of your embedded system with the Texas Instruments MSP430F5637IZQWR microcontroller. With a reputation for excellence, Texas Instruments delivers top-quality products that are reliable and efficient. This microcontroller is designed for a wide range of applications, offering customers value, flexibility, and reliability. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F5637IZQWR provides the performance and features you need to bring your project to life. Trust Texas Instruments to deliver cutting-edge technology that meets your demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and cost-effective material, making the product suitable for various applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of input voltages.

Package Shape: SQUARE

Square shape simplifies PCB layout design and saves space in the overall system configuration.

Bit Size: 16

Offers high computational power and performance for handling complex tasks efficiently.

DAC Channels: YES

Integrated DAC channels provide analog output capabilities for diverse applications requiring precise voltage control.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enhancing compatibility with various voltage requirements.

No. of Terminals: 113

Sufficient number of terminals for versatile connectivity and interfacing with external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Advanced packaging technology for compact form factor and high-density integration, ideal for space-constrained applications.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even at low voltage levels, extending the product's usability in power-sensitive applications.

Maximum Operating Temperature: 85 °C

Wide temperature range support for operation in harsh environmental conditions and industrial applications.

CPU Family: MSP430

Utilizes energy-efficient architecture for optimized power consumption and extended battery life in portable devices.

Minimum Operating Temperature: -40 °C

Allows for reliable performance in extreme cold environments, making the product suitable for outdoor and industrial use.

Terminal Finish: TIN SILVER COPPER

Ensures durable and corrosion-resistant terminal connections, enhancing the product's reliability and longevity.

ADC Channels: YES

Integrated ADC channels for accurate analog-to-digital conversion, essential for sensor data processing and control applications.

DMA Channels: YES

Supports efficient data transfer and processing with Direct Memory Access (DMA) channels, improving system performance and offloading the CPU.

Terminal Position: BOTTOM

Bottom terminal placement for easier PCB routing and design flexibility, optimizing signal integrity and reducing interference.

ROM Words: 196608

Ample on-chip memory capacity for storing program code and data, enabling complex algorithms and applications to run smoothly.

Maximum Seated Height: 1 mm

Low-profile design for space-saving integration in compact electronic devices and PCB assemblies.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual DAC channels with high resolution for precise analog output control, suitable for audio, video, and other analog signal processing applications.

Width: 7 mm

Compact width dimension for efficient board layout and space optimization in electronic designs.

Peripherals: BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Rich set of peripherals for enhanced functionality and versatility in interfacing with external devices and sensors.

Maximum Clock Frequency: 32 MHz

High-speed clock frequency for swift execution of instructions and real-time processing of data, ensuring responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow soldering process with short time duration, reducing thermal stress on components and improving manufacturing throughput.

Peak Reflow Temperature °C: 260

Suitable peak reflow temperature for lead-free soldering process, complying with RoHS standards for environmental sustainability.

Length: 7 mm

Compact length dimension for space-constrained applications and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in challenging environments and industrial automation applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture for efficient and streamlined operation, suitable for embedded control and IoT applications.

RAM Bytes: 18432

A generous amount of RAM for temporary data storage and buffer, facilitating multitasking and data processing capabilities.

Technology: CMOS

CMOS technology for low power consumption and high integration density, enhancing energy efficiency and miniaturization.

Terminal Form: BALL

Ball terminal form factor for reliable connections and high-density mounting, suitable for advanced SMT assembly techniques.

Analog To Digital Convertors: 16-Ch 12-Bit

Multichannel ADC with high resolution for accurate analog signal acquisition and processing in precision measurement and control applications.

Nominal Supply Voltage: 3 V

Stable and common supply voltage for seamless integration with standard power sources in electronic circuits and systems.

PWM Channels: YES

Built-in PWM channels for precise pulse width modulation control, essential for motor control, power regulation, and LED dimming applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Versatile connectivity options for seamless integration with external devices, sensors, and communication networks in IoT and embedded systems.

ROM Programmability: FLASH

Flash memory for flexible and rewritable program storage, allowing for easy firmware updates and program modifications.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density mounting and miniaturization, enabling compact PCB designs with increased functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for moisture resistance during storage and handling, ensuring product reliability and performance under varying environmental conditions.

Speed: 20 rpm

Efficient processing speed for quick data handling and real-time control tasks, enabling responsive performance in dynamic applications.

On Chip Program ROM Width: 8

Sufficient ROM width for storing program code and data on-chip, reducing external memory requirements and system complexity.

No. of I/O Lines: 74

Abundant I/O lines for versatile interfacing with external peripherals, sensors, and devices, enhancing the product's connectivity and functionality.

Technical Specifications

Microcontrollers MSP430F5637IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5637IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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