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MSP430F5637IPZR

Texas Instruments

MSP430F5637IPZR by Texas Instruments

MSP430F5637IPZR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 196608 ROM words, and 16 ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, LCD, and timers. With a max clock frequency of 32MHz, this MCU offers high performance in a compact package.

Median Price

$6.447

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,610 parts In-Stock

1+ parts

$6.447

100+ parts

$5.256

1k+ parts

$3.504

10k+ parts

-

14,610

$6.447

$5.256

$3.504

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,105 parts In-Stock

1+ parts

$6.125

100+ parts

-

1k+ parts

-

10k+ parts

-

2,105

$6.125

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-

-

Vyrian

USA . 5,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,677

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 634 parts In-Stock

1+ parts

$5.802

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$5.802

-

-

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$10.280

100+ parts

-

1k+ parts

-

10k+ parts

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483

$10.280

-

-

-

Microchip USA

USA . 1,426 parts In-Stock

1+ parts

$31.060

100+ parts

$30.860

1k+ parts

$30.770

10k+ parts

$30.670

1,426

$31.060

$30.860

$30.770

$30.670

Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$53.165

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

$53.165

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-

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DigiPath Technology Company

USA . 394 parts In-Stock

1+ parts

$58.541

100+ parts

$53.858

1k+ parts

-

10k+ parts

-

394

$58.541

$53.858

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-

IDEA Electronic Components Group

UK . 1,482 parts In-Stock

1+ parts

$59.736

100+ parts

$56.749

1k+ parts

$53.762

10k+ parts

-

1,482

$59.736

$56.749

$53.762

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ChromeModa Solutions

Germany . 601 parts In-Stock

1+ parts

$59.736

100+ parts

$48.984

1k+ parts

-

10k+ parts

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601

$59.736

$48.984

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Overview

Unlock the limitless possibilities of innovation with the Texas Instruments MSP430F5637IPZR microcontroller. Crafted with precision and expertise, this powerful device offers unrivaled performance and reliability in a wide range of applications. From IoT devices to industrial automation, this versatile microcontroller delivers exceptional value, efficiency, and functionality. Experience the future of technology with Texas Instruments and elevate your projects to new heights with the MSP430F5637IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact PCB design and efficient assembly, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V provides flexibility in power supply options and compatibility with different voltage sources.

RAM Bytes: 16384

Large RAM capacity of 16384 bytes allows for handling complex data processing tasks efficiently and storing large amounts of temporary data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the microcontroller.

ADC Channels: YES

Availability of analog-to-digital converter channels enables the microcontroller to interface with sensors and external analog devices, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture provides high performance, efficient instruction execution, and fast response times, making the microcontroller suitable for real-time applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB facilitate communication with other devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5637IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5637IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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