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MSP430F5635IZCAT

Texas Instruments

MSP430F5635IZCAT by Texas Instruments

MSP430F5635IZCAT by Texas Instruments is a 16-bit microcontroller with 32 MHz max clock freq, 113 terminals, and 2-Ch 12-Bit DACs. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include 16-Ch ADCs, 6 DMA channels, and various connectivity options like I2C, SPI, UART.

Median Price

$8.902

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 879 parts In-Stock

1+ parts

$8.902

100+ parts

$7.257

1k+ parts

$4.838

10k+ parts

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879

$8.902

$7.257

$4.838

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,163 parts In-Stock

1+ parts

$8.457

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1,163

$8.457

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Vyrian

USA . 4,460 parts In-Stock

1+ parts

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4,460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,539 parts In-Stock

1+ parts

$8.012

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2,539

$8.012

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AZTECH Wire

Italy . 68 parts In-Stock

1+ parts

$19.200

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68

$19.200

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Parana Technologies

USA . 831 parts In-Stock

1+ parts

$62.013

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831

$62.013

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DigiPath Technology Company

USA . 2,180 parts In-Stock

1+ parts

$68.284

100+ parts

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2,180

$68.284

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ChromeModa Solutions

Germany . 3,802 parts In-Stock

1+ parts

$69.678

100+ parts

$57.136

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3,802

$69.678

$57.136

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IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$69.678

100+ parts

$66.194

1k+ parts

$62.710

10k+ parts

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1,935

$69.678

$66.194

$62.710

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F5635IZCAT microcontroller. Known for their quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package suitable for a wide range of applications. With features like digital-to-analog converters, analog-to-digital converters, and low power modes, this microcontroller offers unmatched value and benefits to customers looking to streamline their designs and improve efficiency. Whether you're working on IoT devices, smart sensors, or industrial controls, the MSP430F5635IZCAT is the perfect choice for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

ADC Channels: YES

Enables the microcontroller to efficiently convert analog signals to digital data for processing.

ROM Words: 262144

Offers ample storage space for program instructions and data, allowing for complex applications to be implemented.

Maximum Clock Frequency: 32 MHz

Provides high processing speed, making the microcontroller suitable for tasks requiring real-time operation.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined operation, optimizing performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Offers multiple channels for converting analog signals with high precision, suitable for applications requiring accurate analog measurements.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Supports various communication protocols, providing versatility in connecting with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5635IZCAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5635IZCAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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