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MSP430F5634IPZR

Texas Instruments

MSP430F5634IPZR by Texas Instruments

MSP430F5634IPZR by Texas Instruments is a 16-bit microcontroller with 196608 ROM words, 16384 RAM bytes, and 74 I/O lines. It operates at a max clock frequency of 32 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,334 parts In-Stock

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Digiode

USA . 3,140 parts In-Stock

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One Stop Electronics

USA . 1,147 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 850 parts In-Stock

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$11.395

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$11.395

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Microchip USA

USA . 392 parts In-Stock

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$32.290

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$32.090

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$31.990

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$31.890

392

$32.290

$32.090

$31.990

$31.890

Parana Technologies

USA . 664 parts In-Stock

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$73.646

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DigiPath Technology Company

USA . 1,613 parts In-Stock

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$81.093

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$74.606

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IDEA Electronic Components Group

UK . 758 parts In-Stock

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$82.748

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$78.611

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$74.473

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758

$82.748

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$74.473

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ChromeModa Solutions

Germany . 439 parts In-Stock

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$82.748

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$67.853

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QUARKTWIN TECHNOLOGY LTD

USA . 24,375 parts In-Stock

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Corphita

USA . 800 parts In-Stock

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Overview

Discover the Texas Instruments MSP430F5634IPZR, a powerful microcontroller that offers unparalleled quality and reliability. With its innovative technology and robust design, this device is perfect for a wide range of applications in various industries. From industrial automation to consumer electronics, the MSP430F5634IPZR delivers exceptional performance and efficiency. Trust in Texas Instruments, a leading manufacturer known for pushing the boundaries of innovation. Experience the value and benefits this microcontroller brings to your projects, providing you with a competitive edge in the market. Elevate your designs with the MSP430F5634IPZR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for various applications.

Package Shape: SQUARE

Optimal shape for fitting into compact spaces on a PCB.

Bit Size: 16

Offers a good balance between performance and cost for many applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options depending on the requirements of the design.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Minimum Supply Voltage: 2.4 V

Can operate efficiently even with lower voltage inputs.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be present.

CPU Family: MSP430

Part of a well-known and established family of microcontrollers known for their efficiency and performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfers and multitasking capabilities.

ROM Words: 196608

Offers a large amount of non-volatile memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design is suitable for compact devices or applications with limited vertical space.

Width: 14 mm

Compact width allows for efficient placement on a PCB alongside other components.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing and response times for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high-temperature soldering processes without damage.

Peak Reflow Temperature °C: 260

Soldering temperature compatibility for reliable assembly in manufacturing processes.

Length: 14 mm

Compact length allows for efficient use of space on a PCB.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing.

RAM Bytes: 16384

Sufficient random-access memory for data storage and manipulation during operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections for reliable performance.

Nominal Supply Voltage: 3 V

Standard voltage supply for compatibility with common power sources.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of analog signals.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller without requiring external programming equipment.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable dense packaging of components on a PCB for space optimization.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level ensures proper handling and storage to maintain component integrity.

Speed: 20 rpm

Supports communication and control processes at a moderate speed suitable for various applications.

No. of I/O Lines: 74

Provides a sufficient number of Input/Output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5634IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F5634IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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