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MSP430F5633IZQWT

Texas Instruments

MSP430F5633IZQWT by Texas Instruments

MSP430F5633IZQWT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 18432 RAM bytes. It features 16-Ch 12-Bit ADC channels, 6 DMA channels, and peripherals like BOR, LCD, RTC. Ideal for industrial applications requiring low power consumption and high-speed processing up to 32 MHz.

Median Price

$5.257

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.257

10k+ parts

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250

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-

$5.257

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,256 parts In-Stock

1+ parts

$7.666

100+ parts

-

1k+ parts

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10k+ parts

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1,256

$7.666

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Vyrian

USA . 8,465 parts In-Stock

1+ parts

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8,465

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,874 parts In-Stock

1+ parts

$7.263

100+ parts

-

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10k+ parts

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3,874

$7.263

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Microchip USA

USA . 257 parts In-Stock

1+ parts

$16.730

100+ parts

$16.490

1k+ parts

$16.370

10k+ parts

$16.250

257

$16.730

$16.490

$16.370

$16.250

Parana Technologies

USA . 850 parts In-Stock

1+ parts

$67.308

100+ parts

-

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850

$67.308

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DigiPath Technology Company

USA . 420 parts In-Stock

1+ parts

$74.114

100+ parts

-

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420

$74.114

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ChromeModa Solutions

Germany . 3,097 parts In-Stock

1+ parts

$75.627

100+ parts

$62.014

1k+ parts

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3,097

$75.627

$62.014

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IDEA Electronic Components Group

UK . 1,817 parts In-Stock

1+ parts

$75.627

100+ parts

$71.846

1k+ parts

$68.064

10k+ parts

-

1,817

$75.627

$71.846

$68.064

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5633IZQWT microcontroller, designed to elevate your projects to new heights. With a reputation for excellence, Texas Instruments delivers unmatched quality in the field of microcontrollers. This versatile device opens up a world of possibilities across various applications, offering value and benefits that go beyond expectations. Whether you're looking to enhance your connectivity, optimize power consumption, or boost overall performance, the MSP430F5633IZQWT is the ultimate solution for all your needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, providing flexibility in power supply choices.

Bit Size: 16

16-bit architecture allows for higher computational capabilities and precision.

ADC Channels: YES

Built-in Analog to Digital Converters offer the ability to interface with sensors and other analog devices.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing and response times.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options allow for versatile communication with other devices.

Low Power Mode: YES

Includes a low power mode for energy-efficient operation, ideal for battery-powered applications.

Technical Specifications

Microcontrollers MSP430F5633IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5633IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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