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MSP430F5632IPZ

Texas Instruments

MSP430F5632IPZ by Texas Instruments

MSP430F5632IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 32 MHz, making it suitable for industrial applications requiring low power consumption and high-speed processing. With features like DMA channels, PWM channels, and various connectivity options (I2C, SPI, UART), this microcontroller offers versatile solutions for embedded systems design.

Median Price

$10.901

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,106 parts In-Stock

1+ parts

$8.372

100+ parts

$6.825

1k+ parts

$4.550

10k+ parts

-

9,106

$8.372

$6.825

$4.550

-

Mouser Electronics

USA . 616 parts In-Stock

1+ parts

$13.430

100+ parts

$7.860

1k+ parts

$7.140

10k+ parts

-

616

$13.430

$7.860

$7.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,336 parts In-Stock

1+ parts

$7.953

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$7.953

-

-

-

Vyrian

USA . 5,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,807

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,953 parts In-Stock

1+ parts

$7.535

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

$7.535

-

-

-

Parana Technologies

USA . 991 parts In-Stock

1+ parts

$25.071

100+ parts

-

1k+ parts

$25.750

10k+ parts

-

991

$25.071

-

$25.750

-

DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$27.607

100+ parts

$25.398

1k+ parts

-

10k+ parts

-

615

$27.607

$25.398

-

-

ChromeModa Solutions

Germany . 2,463 parts In-Stock

1+ parts

$28.170

100+ parts

$23.099

1k+ parts

-

10k+ parts

-

2,463

$28.170

$23.099

-

-

IDEA Electronic Components Group

UK . 1,061 parts In-Stock

1+ parts

$28.170

100+ parts

$26.762

1k+ parts

$25.353

10k+ parts

-

1,061

$28.170

$26.762

$25.353

-

Kepictronics

USA . 992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

992

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F5632IPZ microcontroller. This high-quality device offers unparalleled performance and reliability, backed by a trusted manufacturer known for innovation. Ideal for a wide range of applications, this microcontroller provides value through its efficiency, advanced features, and seamless connectivity options. Experience the benefits of cutting-edge technology with the MSP430F5632IPZ and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easier to handle and more affordable.

Maximum Supply Voltage: 3.6 V

Allows for a wider range of input voltage, providing flexibility in power supply options.

No. of Terminals: 100

Plenty of terminals allow for a wide variety of connections and interfaces, enhancing the product's versatility.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate conversion of analog signals to digital data, expanding the product's capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers high performance and efficiency, making this product suitable for demanding applications.

Connectivity: "I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB enable seamless communication with other devices or systems.

Speed: 20 rpm

Operating at a speed of 20 rpm, this microcontroller can efficiently process instructions and data, making it a reliable choice.

Low Power Mode: YES

Ability to operate in low power mode conserves energy, prolonging battery life and reducing overall power consumption.

Technical Specifications

Microcontrollers MSP430F5632IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), SPI(4), UART(2), USB"

Peripherals:

"BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT"

Trade Compliance

MSP430F5632IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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