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MSP430F5631IZQWR

Texas Instruments

MSP430F5631IZQWR by Texas Instruments

MSP430F5631IZQWR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 18432 bytes RAM, and 196608 ROM words. Ideal for industrial applications, it features peripherals like BOR, DMA(6), LCD, RTC, and USB connectivity. Operating temperature ranges from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,005 parts In-Stock

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7,005

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Digiode

USA . 4,403 parts In-Stock

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4,403

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Distributors (Availability)

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$6.023

100+ parts

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560

$6.023

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One Stop Electronics

USA . 353 parts In-Stock

1+ parts

$30.000

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353

$30.000

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Parana Technologies

USA . 178 parts In-Stock

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$66.043

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178

$66.043

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DigiPath Technology Company

USA . 602 parts In-Stock

1+ parts

$72.722

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602

$72.722

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ChromeModa Solutions

Germany . 2,812 parts In-Stock

1+ parts

$74.206

100+ parts

$60.849

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2,812

$74.206

$60.849

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IDEA Electronic Components Group

UK . 714 parts In-Stock

1+ parts

$74.206

100+ parts

$70.496

1k+ parts

$66.785

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714

$74.206

$70.496

$66.785

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Component Stockers USA

USA . 383 parts In-Stock

1+ parts

$99.990

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Corphita

USA . 3,677 parts In-Stock

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Microchip USA

USA . 388 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430F5631IZQWR by Texas Instruments, a high-quality microcontroller that not only meets the rigorous standards set by its reputable manufacturer but also offers unparalleled value to customers. Ideal for a wide range of applications, this microcontroller delivers exceptional performance and reliability, ensuring seamless operation in industrial settings. With advanced features such as PWM channels, connectivity options, and on-chip program ROM, the MSP430F5631IZQWR is the perfect choice for those looking to elevate their projects to new heights. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and robustness, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with various voltage sources.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate and space-saving design.

Bit Size: 16

A 16-bit architecture enables efficient processing of data and instructions, suitable for a wide range of applications requiring moderate computational power.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) offers flexibility in power management and compatibility with various power sources.

No. of Terminals: 113

The high number of terminals allows for extensive connectivity options and integration with various peripherals and external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting, saving valuable board space and allowing for compact designs.

Minimum Supply Voltage: 2.4 V

The minimum supply voltage of 2.4V ensures efficient power management and operation under low power conditions, suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions and industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption, high performance, and integration of various peripherals, making it a preferred choice for energy-efficient applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency and relieve the CPU of data transfer tasks, improving overall system performance.

ROM Words: 196608

The large ROM capacity of 196608 words allows for storing a significant amount of program instructions and data, enabling complex applications and firmware.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32MHz enables fast processing speed and real-time operation, suitable for applications requiring quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a Reduced Instruction Set Computing (RISC) architecture, this product offers efficient and optimized performance for embedded systems.

RAM Bytes: 18432

The ample RAM capacity of 18432 bytes allows for efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with various digital circuits, ensuring energy-efficient operation.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of analog signals, making this product suitable for applications that require accurate control of motor speeds, LED brightness, etc.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options including I2C, IRDA, SPI, UART, and USB allow for seamless communication with external devices and peripherals, enhancing the product's versatility and integration capabilities.

ROM Programmability: FLASH

Flash programmable ROM offers flexibility in firmware updates and customization, allowing for easy modification of program code and data storage.

No. of I/O Lines: 74

With 74 I/O lines, this product offers versatile input/output options, enabling connection to a wide range of external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers MSP430F5631IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5631IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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