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MSP430F5528IZQE

Texas Instruments

MSP430F5528IZQE by Texas Instruments

MSP430F5528IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It features 10-Ch 12-Bit ADC channels, 4 timers, and connectivity options like I2C, SPI, UART, USB. Ideal for industrial applications requiring low power consumption and high-speed processing up to 32 MHz.

Median Price

$12.190

Lifecycle Status

Suppliers In-Stock

9

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American Microsemiconductor Inc.

USA . 105 parts In-Stock

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Vyrian

USA . 880 parts In-Stock

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Digiode

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Nova Conductors

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Bristol Electronics

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Atlantic Semiconductor

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Quantum Digital Technology

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

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Ampacity Inc.

Singapore . 233 parts In-Stock

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$10.000

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One Stop Electronics

USA . 437 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 556 parts In-Stock

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Semicontronic

India . 1,366 parts In-Stock

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Parana Technologies

USA . 52 parts In-Stock

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$57.960

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ChromeModa Solutions

Germany . 1,770 parts In-Stock

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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DigiPath Technology Company

USA . 1,248 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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$7.531

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$7.531

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$7.531

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Futuretech Components

Singapore . 828 parts In-Stock

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Microchip USA

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5528IZQE microcontroller. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This versatile microcontroller is perfect for a wide range of applications, offering customers value and benefits like low power consumption, high performance, and a variety of connectivity options including I2C, SPI, UART, and USB. Whether you're developing a smart home device or a wearable technology, the MSP430F5528IZQE provides the performance and efficiency you need to bring your ideas to life. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility in power supply options.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage on the chip.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for constrained design layouts.

Bit Size: 16

16-bit architecture enables high-performance computing capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply options, providing flexibility in design and application.

No. of Terminals: 80

Having 80 terminals allows for a wide range of connectivity options and peripherals to be attached.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array with fine pitch and thin profile enables high-density mounting and efficient use of space on PCBs.

Minimum Supply Voltage: 2.4 V

Supports a minimum supply voltage of 2.4V, ensuring reliable operation even in low power conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can handle industrial temperature environments.

CPU Family: MSP430

MSP430 CPU family offers low power consumption and high integration, suitable for battery-operated and portable devices.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, making it versatile for various environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance.

ADC Channels: YES

Analog-to-digital converter channels enable precise conversion of analog signals for various sensor applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load for faster processing.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances thermal performance.

ROM Words: 131072

131072 ROM words offer ample storage for firmware and program code.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm saves space and allows for compact device designs.

RAM Words: 8

8 RAM words provide efficient memory storage for data processing and temporary storage.

Width: 5 mm

Compact width of 5mm enables easy integration into small form factor devices.

Boundary Scan: YES

Boundary scan feature simplifies testing and debugging processes during production and maintenance.

Peripherals: "COMPARATOR(8), RTC, TIMER(4)

Comparator, real-time clock, and timer peripherals enhance functionality and enable precise timing and measurement capabilities.

Maximum Clock Frequency: 32 MHz

High clock frequency of 32 MHz allows for fast processing speeds and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring robust soldering and assembly capabilities.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C supports reliable soldering and solder joint quality.

Length: 5 mm

5mm length provides a balanced form factor for compact device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and energy efficiency for embedded applications.

No. of Timers: 4

Four timers allow for precise timing functions and event scheduling.

RAM Bytes: 8192

8192 RAM bytes provide ample memory space for data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates soldering and mounting processes for easy integration onto PCBs.

Analog To Digital Convertors: 10-Ch 12-Bit

Ten-channel 12-bit ADCs enable accurate analog signal conversion for a wide range of sensor applications.

Maximum Supply Current: 11 mA

Low supply current consumption of 11mA allows for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V ensures compatibility with standard power sources and regulators.

No. of DMA Channels: 3

Three DMA channels provide efficient data transfer capabilities and reduce CPU overhead for faster processing.

No. of Serial I/Os: 4

Four serial I/O interfaces enable communication with external devices and peripherals for enhanced connectivity.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of output signals and motor speed regulation.

Connectivity: "I2C(2), SPI(4), UART(2), USB

Multiple connectivity options including I2C, SPI, UART, and USB enhance communication capabilities with external devices and sensors.

ROM Programmability: FLASH

Flash programmability enables easy updating and reprogramming of firmware and application code.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations and reduces computational complexity for signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard manufacturing and storage conditions.

Speed: 25 rpm

Operating speed of 25 rpm enables efficient processing and response times for real-time applications.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extended battery life in power-constrained applications.

On Chip Program ROM Width: 8

8-bit program ROM width provides efficient storage and execution of program code on the chip.

No. of I/O Lines: 47

Forty-seven I/O lines offer versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5528IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5528IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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