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MSP430F5526IYFFT

Texas Instruments

MSP430F5526IYFFT by Texas Instruments

MSP430F5526IYFFT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 12 ADC channels, DMA support, and peripherals like RTC and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,366 parts In-Stock

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Digiode

USA . 1,804 parts In-Stock

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AZTECH Wire

Italy . 305 parts In-Stock

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$17.373

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Parana Technologies

USA . 1,028 parts In-Stock

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$17.511

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$17.705

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DigiPath Technology Company

USA . 759 parts In-Stock

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$19.282

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ChromeModa Solutions

Germany . 2,796 parts In-Stock

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IDEA Electronic Components Group

UK . 2,296 parts In-Stock

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$18.691

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$17.708

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One Stop Electronics

USA . 267 parts In-Stock

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$22.000

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Component Stockers USA

USA . 787 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Discover the power and precision of the MSP430F5526IYFFT microcontroller from Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers cutting-edge technology in a compact package. This versatile microcontroller is ideal for a wide range of applications, offering customers unmatched value and performance. From industrial automation to consumer electronics, the MSP430F5526IYFFT provides the reliability and efficiency you need to bring your projects to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides good durability and resistance to moisture, making the microcontroller suitable for a variety of environments.

Bit Size: 16

16-bit architecture allows for higher precision and more complex calculations compared to lower bit sizes, enhancing the microcontroller's performance.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V offers flexibility in power supply options and compatibility with a wide range of applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch allows for space-efficient mounting on circuit boards, making it ideal for compact designs.

ADC Channels: YES

Built-in Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and signals, expanding its compatibility with various input sources.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller provides ample memory for data storage and processing, enhancing its capability to handle complex algorithms and multitasking.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32MHz allows for fast execution of instructions and efficient operation, making the microcontroller suitable for applications requiring high-speed processing.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB support enable the microcontroller to communicate with a variety of external devices and peripherals, enhancing its versatility and compatibility.

Technical Specifications

Microcontrollers MSP430F5526IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

3.76 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

47

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430F5526IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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