Loading...

MSP430F5524IZXH

Texas Instruments

MSP430F5524IZXH by Texas Instruments

MSP430F5524IZXH by Texas Instruments is a 16-bit microcontroller with 80 terminals, 32 MHz clock frequency, and 4096 RAM words. Ideal for industrial applications requiring low power consumption, it features 10-Ch 12-Bit ADCs, USB connectivity, and multiple timers for precise control.

Median Price

$10.295

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,466 parts In-Stock

1+ parts

$7.710

100+ parts

$6.285

1k+ parts

$4.190

10k+ parts

-

1,466

$7.710

$6.285

$4.190

-

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$12.880

100+ parts

$8.670

1k+ parts

$6.720

10k+ parts

$6.650

7

$12.880

$8.670

$6.720

$6.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,970 parts In-Stock

1+ parts

$7.324

100+ parts

-

1k+ parts

-

10k+ parts

-

4,970

$7.324

-

-

-

Vyrian

USA . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,525

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,821 parts In-Stock

1+ parts

$6.939

100+ parts

-

1k+ parts

-

10k+ parts

-

2,821

$6.939

-

-

-

Microchip USA

USA . 2,900 parts In-Stock

1+ parts

$18.370

100+ parts

$18.100

1k+ parts

$17.970

10k+ parts

$17.840

2,900

$18.370

$18.100

$17.970

$17.840

Parana Technologies

USA . 1,899 parts In-Stock

1+ parts

$60.832

100+ parts

-

1k+ parts

-

10k+ parts

-

1,899

$60.832

-

-

-

DigiPath Technology Company

USA . 1,356 parts In-Stock

1+ parts

$66.984

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

$66.984

-

-

-

ChromeModa Solutions

Germany . 6,548 parts In-Stock

1+ parts

$68.351

100+ parts

$56.048

1k+ parts

-

10k+ parts

-

6,548

$68.351

$56.048

-

-

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$68.351

100+ parts

$64.933

1k+ parts

$61.516

10k+ parts

-

806

$68.351

$64.933

$61.516

-

Overview

Experience unmatched quality and innovation with the MSP430F5524IZXH by Texas Instruments, a leading manufacturer in the field of microcontrollers. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features and benefits. From its high-performance capabilities to its low power consumption, customers can trust in the reliability and efficiency of this microcontroller. Upgrade your projects with the MSP430F5524IZXH and discover the endless possibilities it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and provides good protection for the microcontroller, making it reliable for long-term use.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can operate efficiently even in high voltage scenarios without risking damage.

ROM Words: 65536

With a ROM size of 65536 words, this microcontroller can store a large amount of program code, allowing for complex applications to be run smoothly.

Maximum Clock Frequency: 32 MHz

The maximum clock frequency of 32 MHz ensures fast processing speed, making this microcontroller suitable for applications that require quick response times.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital, enabling accurate readings from sensors or other analog input devices.

Connectivity: I2C(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, SPI, UART, and USB make it easy to interface with various devices, expanding the range of applications this microcontroller can be used for.

Low Power Mode: YES

The low power mode feature helps in conserving energy, making this microcontroller suitable for battery-powered applications or situations where power consumption needs to be minimized.

Technical Specifications

Microcontrollers MSP430F5524IZXH attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(8), DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5524IZXH Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20