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MSP430F5524IZQE

Texas Instruments

MSP430F5524IZQE by Texas Instruments

MSP430F5524IZQE by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 10-Ch 12-Bit ADC channels and offers connectivity through I2C, SPI, UART, and USB interfaces. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.180

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 313 parts In-Stock

1+ parts

-

100+ parts

$5.180

1k+ parts

$4.630

10k+ parts

$4.360

313

-

$5.180

$4.630

$4.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,812 parts In-Stock

1+ parts

$5.462

100+ parts

-

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3,812

$5.462

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Vyrian

USA . 7,803 parts In-Stock

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7,803

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DigiKey Marketplace

USA . 313 parts In-Stock

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313

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 962 parts In-Stock

1+ parts

$5.175

100+ parts

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962

$5.175

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Parana Technologies

USA . 1,326 parts In-Stock

1+ parts

$67.604

100+ parts

$6,278.011

1k+ parts

$60.843

10k+ parts

-

1,326

$67.604

$6,278.011

$60.843

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DigiPath Technology Company

USA . 800 parts In-Stock

1+ parts

$74.440

100+ parts

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800

$74.440

-

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ChromeModa Solutions

Germany . 4,695 parts In-Stock

1+ parts

$75.959

100+ parts

$62.286

1k+ parts

-

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4,695

$75.959

$62.286

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

1+ parts

$75.959

100+ parts

$72.161

1k+ parts

$68.363

10k+ parts

-

1,657

$75.959

$72.161

$68.363

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Kepictronics

USA . 3,505 parts In-Stock

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3,505

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Microchip USA

USA . 438 parts In-Stock

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438

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5524IZQE microcontroller. Designed to meet the highest quality standards, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430F5524IZQE delivers exceptional value, efficiency, and flexibility that will elevate your projects to new heights. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it a reliable choice for various applications.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, allowing for more flexible power supply options in different circuits.

No. of Terminals: 80

With a large number of terminals, this microcontroller can accommodate complex circuit designs and connections.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors or inputs, expanding its functionality.

Maximum Clock Frequency: 32 MHz

Offers a high maximum clock frequency, enabling fast processing speeds and real-time operation in applications that require quick calculations.

Connectivity: "I2C(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, SPI, UART, and USB make it versatile for communication with other devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5524IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5524IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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