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MSP430F5522IZXH

Texas Instruments

MSP430F5522IZXH by Texas Instruments

MSP430F5522IZXH by Texas Instruments is a 16-bit microcontroller with 80 terminals, 32 MHz clock frequency, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, PWM, and UART connectivity. With a wide operating temperature range of -40 to 85 °C, this CMOS technology-based MCU offers high performance in a compact package.

Median Price

$5.957

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,901 parts In-Stock

1+ parts

$4.044

100+ parts

$3.544

1k+ parts

$2.002

10k+ parts

-

2,901

$4.044

$3.544

$2.002

-

Mouser Electronics

USA . 476 parts In-Stock

1+ parts

$7.870

100+ parts

$4.560

1k+ parts

$3.900

10k+ parts

$3.720

476

$7.870

$4.560

$3.900

$3.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 337 parts In-Stock

1+ parts

$3.842

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$3.842

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-

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Vyrian

USA . 4,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,470

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,409 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

$3.640

-

-

-

Microchip USA

USA . 2,499 parts In-Stock

1+ parts

$21.820

100+ parts

$21.680

1k+ parts

$21.620

10k+ parts

$21.550

2,499

$21.820

$21.680

$21.620

$21.550

Parana Technologies

USA . 702 parts In-Stock

1+ parts

$61.301

100+ parts

-

1k+ parts

-

10k+ parts

-

702

$61.301

-

-

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DigiPath Technology Company

USA . 2,245 parts In-Stock

1+ parts

$67.500

100+ parts

$62.100

1k+ parts

-

10k+ parts

-

2,245

$67.500

$62.100

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-

ChromeModa Solutions

Germany . 4,515 parts In-Stock

1+ parts

$68.878

100+ parts

$56.480

1k+ parts

-

10k+ parts

-

4,515

$68.878

$56.480

-

-

IDEA Electronic Components Group

UK . 380 parts In-Stock

1+ parts

$68.878

100+ parts

$65.434

1k+ parts

$61.990

10k+ parts

-

380

$68.878

$65.434

$61.990

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F5522IZXH Microcontroller. Designed to deliver unparalleled performance and reliability, this cutting-edge product is perfect for a wide range of applications. From industrial automation to consumer electronics, the MSP430F5522IZXH offers high-quality features and advanced technology that will take your projects to the next level. With its low power consumption and versatile connectivity options, this microcontroller provides exceptional value and benefits to customers looking to create efficient and innovative solutions. Trust in Texas Instruments for top-of-the-line products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount design makes it easier to integrate this microcontroller onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Ability to operate at relatively high supply voltage makes it versatile for different applications.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and manipulation.

Package Shape: SQUARE

Square package shape is space-efficient and ensures easy placement on the PCB.

Bit Size: 16

16-bit architecture enables the microcontroller to handle more complex operations and calculations.

No. of Terminals: 80

Having a high number of terminals allows for more connectivity options and peripherals to be connected.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for operation in low-power scenarios or with limited power sources.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures makes it suitable for industrial applications where heat may be a factor.

CPU Family: MSP430

Belonging to the MSP430 family means it has a proven track record of performance and reliability in microcontroller applications.

Minimum Operating Temperature: -40 °C

Wide operational temperature range allows for use in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and resistance to corrosion, ensuring stable connections.

ADC Channels: YES

Presence of Analog to Digital Converter channels allows for easy interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and efficiency in data-intensive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and energy efficiency in processing instructions.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing of instructions, making it suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and energy efficiency in processing instructions.

Connectivity: I2C(2), SPI(4), UART(2), USB

Multiple connectivity options allow for easy integration with various devices and communication protocols.

Technical Specifications

Microcontrollers MSP430F5522IZXH attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(8), DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5522IZXH Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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