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MSP430F5510CY

Texas Instruments

MSP430F5510CY by Texas Instruments

The Texas Instruments MSP430F5510CY is a 16-bit microcontroller with a max clock frequency of 32 MHz. It features DAC, ADC, and PWM channels for versatile applications. With a supply voltage range of 2.4V to 3.6V, it is ideal for low-power embedded systems requiring high-speed processing capabilities.

Median Price

$4.408

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,764 parts In-Stock

1+ parts

$4.408

100+ parts

-

1k+ parts

-

10k+ parts

-

3,764

$4.408

-

-

-

Vyrian

USA . 2,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,645

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 81 parts In-Stock

1+ parts

$3.940

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$3.940

-

-

-

Corphita

USA . 4,063 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

-

4,063

$4.176

-

-

-

Parana Technologies

USA . 224 parts In-Stock

1+ parts

$26.468

100+ parts

-

1k+ parts

$27.051

10k+ parts

-

224

$26.468

-

$27.051

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

$29.144

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$29.144

-

-

-

ChromeModa Solutions

Germany . 2,853 parts In-Stock

1+ parts

$29.739

100+ parts

$24.386

1k+ parts

-

10k+ parts

-

2,853

$29.739

$24.386

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-

IDEA Electronic Components Group

UK . 1,728 parts In-Stock

1+ parts

$29.739

100+ parts

$28.252

1k+ parts

$26.765

10k+ parts

-

1,728

$29.739

$28.252

$26.765

-

Overview

Unlock limitless possibilities with the Texas Instruments MSP430F5510CY microcontroller. Known for its superior quality and reliability, Texas Instruments is a leader in the industry. This microcontroller is perfect for a wide range of applications, from wearables to industrial automation. With advanced features like DAC and ADC channels, DMA channels, and PWM channels, this product offers unmatched value and benefits to customers looking to create innovative solutions. Say hello to unparalleled performance and efficiency with the MSP430F5510CY.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements for different projects.

Bit Size: 16

Having a 16-bit architecture offers higher precision and performance compared to lower bit microcontrollers.

DAC Channels: YES

Digital-to-analog converters enable analog signal outputs, expanding the range of possible applications for this microcontroller.

Package Style (Meter): UNCASED CHIP

The uncased chip package style allows for direct PCB mounting, simplifying the assembly process and reducing space requirements.

Minimum Supply Voltage: 2.4 V

Operates efficiently at low supply voltages, offering power-saving capabilities for battery-powered devices.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to process analog inputs, making it suitable for a wide range of sensor-based applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, enhancing the overall performance of the microcontroller in data-intensive tasks.

Terminal Position: UPPER

The upper terminal position simplifies PCB layout and connection routing, contributing to easier integration into electronic systems.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, this microcontroller can execute instructions faster, making it suitable for applications that require rapid processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on the RISC architecture, this microcontroller offers efficient instruction execution, resulting in improved performance and power efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making this microcontroller suitable for battery-operated devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and connection processes, enhancing reliability and ease of assembly.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V matches common power supply standards, simplifying integration into existing electronic systems.

PWM Channels: YES

Pulse-width modulation channels provide precise control over analog outputs, making this microcontroller ideal for applications requiring accurate voltage or signal regulation.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates, enabling future-proofing and customization of the microcontroller's functionality.

Speed: 25 rpm

Operating at a speed of 25 rotations per minute, this microcontroller can efficiently process instructions and data, meeting the performance requirements of various applications.

Technical Specifications

Microcontrollers MSP430F5510CY attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-XUUC-N

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

MSP430F5510CY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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