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MSP430F5509IZQER

Texas Instruments

MSP430F5509IZQER by Texas Instruments

MSP430F5509IZQER by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 24576 ROM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 12-Ch 10-Bit ADCs, USB connectivity, and multiple timers, it offers versatile solutions in embedded systems design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,470 parts In-Stock

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Digiode

USA . 185 parts In-Stock

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185

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AZTECH Wire

Italy . 307 parts In-Stock

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$10.857

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307

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Parana Technologies

USA . 712 parts In-Stock

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$31.583

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$82.960

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712

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One Stop Electronics

USA . 1,555 parts In-Stock

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$32.000

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$32.000

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DigiPath Technology Company

USA . 1,602 parts In-Stock

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$34.777

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1,602

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ChromeModa Solutions

Germany . 4,257 parts In-Stock

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$35.487

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$29.099

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4,257

$35.487

$29.099

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IDEA Electronic Components Group

UK . 414 parts In-Stock

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$35.487

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$33.713

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$31.938

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414

$35.487

$33.713

$31.938

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QUARKTWIN TECHNOLOGY LTD

USA . 19,181 parts In-Stock

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Corphita

USA . 2,501 parts In-Stock

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Microchip USA

USA . 388 parts In-Stock

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Overview

Discover the cutting-edge MSP430F5509IZQER microcontroller by Texas Instruments, a powerhouse in the world of technology. This innovative product offers unmatched quality and reliability, making it a top choice for applications in various industries. With its advanced features and high-performance capabilities, this microcontroller delivers value, efficiency, and flexibility to customers seeking top-notch solutions. Experience the benefits of Texas Instruments' expertise and elevate your projects to new heights with the MSP430F5509IZQER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material allows for the product to withstand various environmental conditions, making it reliable for long-term use.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for more power to be delivered to the microcontroller, enabling it to handle more complex operations efficiently.

RAM Words: 2048

With a large RAM capacity, this microcontroller can efficiently store and process a significant amount of data, making it suitable for applications that require extensive memory usage.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables the microcontroller to execute tasks at a faster rate, improving overall performance and responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller, it can execute instructions more efficiently, leading to faster processing speeds and reduced power consumption.

Technical Specifications

Microcontrollers MSP430F5509IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5509IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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