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MSP430F5509IRGCT

Texas Instruments

MSP430F5509IRGCT by Texas Instruments

MSP430F5509IRGCT by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 24576 ROM words. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$1.840

100+ parts

$1.800

1k+ parts

$1.770

10k+ parts

-

500

$1.840

$1.800

$1.770

-

Texas Instruments

USA . 8,251 parts In-Stock

1+ parts

$3.959

100+ parts

$3.469

1k+ parts

$1.960

10k+ parts

-

8,251

$3.959

$3.469

$1.960

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,280 parts In-Stock

1+ parts

$3.761

100+ parts

-

1k+ parts

-

10k+ parts

-

4,280

$3.761

-

-

-

Vyrian

USA . 8,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,305

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 949 parts In-Stock

1+ parts

$3.563

100+ parts

-

1k+ parts

-

10k+ parts

-

949

$3.563

-

-

-

AZTECH Wire

Italy . 1,005 parts In-Stock

1+ parts

$17.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

$17.630

-

-

-

Parana Technologies

USA . 779 parts In-Stock

1+ parts

$68.938

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$68.938

-

-

-

ChromeModa Solutions

Germany . 1,887 parts In-Stock

1+ parts

$77.458

100+ parts

$63.516

1k+ parts

-

10k+ parts

-

1,887

$77.458

$63.516

-

-

IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$77.458

100+ parts

$73.585

1k+ parts

$69.712

10k+ parts

-

615

$77.458

$73.585

$69.712

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iodParts Technologies Inc.

India . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,600

-

-

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DigiPath Technology Company

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

$69.836

1k+ parts

-

10k+ parts

-

2,287

-

$69.836

-

-

Overview

Experience the power of innovation with the Texas Instruments MSP430F5509IRGCT microcontroller. As a leader in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. The MSP430F5509IRGCT offers a wide range of applications in various industries, providing customers with unparalleled value and benefits. Embrace cutting-edge technology and unlock endless possibilities with this advanced microcontroller, designed to meet your needs and exceed your expectations. Choose Texas Instruments for superior quality and unmatched excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

On Chip Data RAM Width: 16

Wide on-chip data RAM width enables faster processing and storage of data within the microcontroller.

Bit Size: 16

16-bit processing provides higher precision and performance compared to lower bit size microcontrollers.

ROM Words: 24576

Large ROM size allows for storage of complex programs and data, making the microcontroller suitable for advanced applications.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast data processing and execution speeds, enhancing overall performance.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels with 10-bit resolution provide accurate analog to digital conversion for precise sensor interfacing and data acquisition.

Connectivity: I2C, SPI(2), UART, USB

Various connectivity options such as I2C, SPI, UART, and USB allow for versatile communication with external devices and peripherals.

Low Power Mode: YES

Low power mode helps to optimize energy efficiency and prolong battery life, making the microcontroller suitable for portable and low-power applications.

Technical Specifications

Microcontrollers MSP430F5509IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5509IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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