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MSP430F5509IPTR

Texas Instruments

MSP430F5509IPTR by Texas Instruments

MSP430F5509IPTR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features ADC and DMA channels, 4096 bytes of RAM, and ROM programmability for various industrial applications requiring low power consumption and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,085 parts In-Stock

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Digiode

USA . 2,146 parts In-Stock

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One Stop Electronics

USA . 1,004 parts In-Stock

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$2.000

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1,004

$2.000

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AZTECH Wire

Italy . 807 parts In-Stock

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$13.896

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Parana Technologies

USA . 376 parts In-Stock

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$21.181

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$21.469

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376

$21.181

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$21.469

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DigiPath Technology Company

USA . 52 parts In-Stock

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$23.323

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52

$23.323

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IDEA Electronic Components Group

UK . 1,660 parts In-Stock

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$23.799

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$22.609

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$21.419

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1,660

$23.799

$22.609

$21.419

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ChromeModa Solutions

Germany . 983 parts In-Stock

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$23.799

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$19.515

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983

$23.799

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Corphita

USA . 3,131 parts In-Stock

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Microchip USA

USA . 486 parts In-Stock

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Overview

Unlock the endless possibilities with the Texas Instruments MSP430F5509IPTR microcontroller. Designed with precision and expertise, this device offers unparalleled performance and reliability in a wide range of applications. From IoT devices to industrial automation, this microcontroller is the perfect choice for your next project. With its advanced features and innovative technology, the MSP430F5509IPTR provides exceptional value and benefits to customers looking to take their designs to the next level. Trust in Texas Instruments to deliver quality and excellence every step of the way.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material provides excellent durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage : 3.6 V

Higher supply voltage allows for powering more components and peripherals, enhancing the capabilities of the microcontroller.

Bit Size : 16

16-bit architecture allows for more complex and advanced calculations and operations compared to lower bit sizes, making it suitable for demanding tasks.

CPU Family : MSP430

MSP430 CPU family is known for its low power consumption, making the microcontroller energy-efficient and ideal for battery-powered devices.

Minimum Operating Temperature : -40 °C

With a wide operating temperature range, the microcontroller can function reliably in extreme cold conditions without any performance issues.

RAM Bytes : 4096

Having a larger RAM size allows the microcontroller to handle more data and programs simultaneously, improving overall performance and multitasking capabilities.

Technology : CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers MSP430F5509IPTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F5509IPTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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